Please follow these usage requirements when using solder paste?

Shenzhen JJY Industrial Technology Co., Ltd. mainly producesSolder pasteTin wire, tin bar, red glue Such welding products; The product is widely applied inLEDManufacturers, electrical products, Bluetooth, headphones, game consoles, medical equipment, etc. Then, when using solder paste, please follow the following usage requirements to avoid unnecessary trouble. Now, the manufacturer of JJY solder paste will tell you:

Notes:

1The solder paste should be sealed and stored in the refrigerator at a controlled temperature5±3ºCIts validity period is guaranteed6 One month(Within the shelf life of the solder paste),

2Solder paste from the time of purchase and storage,That is to be included in the control.,Any abnormal movement,It is necessary to fill in the solder paste usage record.

3The amount of used solder paste after opening a newly bottled bottle exceeds24H,All shall be scrapped..

When using solder paste, the following points should be noted:

1When in use, it should be used at least in advance4HTake it out of the refrigerator, write down the time, number, user and applied product, seal it and place it at room temperature. Open the bottle cap when the solder paste reaches room temperature. If opened at low temperatures, it is prone to absorbing moisture and may produce solder beads during re-soldering. Note: Do not place the solder paste beside a hot air heater, air conditioner, etc. to accelerate its temperature rise.

2After opening, it should be stirred at least with a blender30sOr stir by hand5minMake the components in the solder paste uniform and reduce the viscosity of the solder paste.

3After the first printed circuit board is printed on the shift or the equipment is adjusted, the thickness of the printed solder paste should be measured using a solder paste thickness tester. The test points should be selected at the top, bottom, left, right and middle of the test surface of the printed circuit board5Point and record the values. The thickness range of the solder paste should be within the thickness of the screen plate-10%-+15%Between.

4Place it on the mesh plate and exceed30minWhen not in use, it should be stirred first with the stirring function of the screen printing machine before use. If the interval in between is relatively long(More than1h)The solder paste should be put back into the can and the bottle cap should be tightly closed. After reusing the solder paste and opening it, it should be stirred at least with a blender or by hand to ensure that all components in the solder paste are uniform.

5The amount of solder paste added to the screen board for the first time is determined by the surface of the printed circuit board and the number of solder joints. Generally, it is added for the first time200-300gAfter printing for a period of time, add a little more appropriately to ensure that the solder paste rolls clockwise along the forward direction of the squeegee during printing, with a thickness of approximately equal to1/2to3/4The height of a metal scraper.

6After the solder paste is printed on the board, it should be mounted as soon as possible to prevent the evaporation of solvents such as solder paste. In principle, it should not exceed this time8hIf the time is exceeded, the solder paste should be cleaned and reprinted.

7After opening, in principle, it should be used up in one go on the same day. Solder paste that has exceeded the usage period must not be used under any circumstances. The solder paste scraped back from the mesh plate should also be sealed and refrigerated.

8The optimal temperature for printing time is25℃±3℃Temperature is relative to temperature45%-65%It is advisable. When the temperature is too high, the solder paste is prone to absorbing moisture and generating solder beads during reflow soldering.

9Do not put fresh solder paste and used solder paste into the same bottle. When removing the solder paste from the mesh plate, use another empty bottle to store it to prevent the fresh solder paste from being contaminated by the old solder paste.

10When using new and old solder paste together, it is recommended to use1/4The old solder paste and3/4Stir the fresh solder paste evenly together to ensure that both the new and old solder pastes are in the best condition when mixed.

11During the production process, the quality of solder paste printing is inspected100%The main contents of the inspection are whether the solder paste pattern is complete, whether the thickness is uniform, and whether there is any solder paste sharpening phenomenon.

12After the shift work is completed, clean the mesh plates in accordance with the process requirements.

13After the printing experiment or printing failure, the solder paste on the printed circuit board should be thoroughly cleaned with an ultrasonic cleaning device and dried to prevent solder balls from forming after reflow soldering due to residual solder paste on the board when it is used again.

Shenzhen JJY Industrial Technology Co., LTDIt has a huge technical foundation and production capacity; The company is located in Qinghu Science and Technology Park, Qingxiang Road, Qinghu Community, Longhua Street5000The production site is flat and strictly implementedISO9001System. Multiple inspection procedures ensure the stable performance of tin materials. Raw materials are inspected upon entry into the warehouse, products are inspected upon exit from the warehouse, and samples are taken for tin melting and finished products to test whether the formula meets the standards and is environmentally friendly. All environmental protection products have passedSGSTest, in complianceRoHSInstruction, carELVInstructions andREACHStandard.