How to solve the faults during the use of solder paste?

Everyone is well aware that we will encounter some problems during the solder paste operation process. These problems can cause some malfunctions or other factors, thereby affecting the quality of the cost. I believe everyone will encounter these matters. If these problems are not dealt with and solved, it will definitely cause unnecessary impacts on the enterprise. Therefore, everyone should understand some common problems that occur during the soldering process0When obstacles arise, record them and find ways to solve them. Regarding this aspect, Jia JinyuanSolder paste manufacturerI have some corresponding experience. Now let me share it with you all:

1What effects does the storage environment of solder paste, if the temperature is too high or too low, have on the viscosity of the solder paste and the activator?
 Answer: An increase in the internal temperature of the solder paste is a bad signal, indicating that the reaction inside is very intense. The viscosity will immediately rise and gradually form lumps. The storage environment for solder paste is in the refrigerator, and the temperature is generally at2~10℃The shelf life of the solder paste is about six months (unopened). Do not place in direct sunlight.

2What effects will occur if the temperature of the solder paste storage environment is too low?
 Answer: Store at too low a temperature,The flux in the solder paste will be affected. There is adhesive in the flux,The adhesive is at a temperature lower than2℃At that time,Crystallization will occur,This phenomenon will destroy the molecular structure. Warm up before use,The performance of solder paste is bound to be lost to a certain extent.

3How can we ensure that the solder paste has a good storage environment?
 Answer: In fact, solder paste is placed in the refrigerator to extend its shelf life. As we all know, solder paste contains active substances, and the ability of these active substances to release activity is related to temperature. The higher the temperature, the stronger the ability to release activity, and the more likely the solder paste is to deteriorate. So when not in use, it is better to store it in the refrigerator, which can ensure the quality of the solder paste..

4How to solve the problem of false soldering when using solder paste?
 Answer: The problems of false soldering and fake soldering in welding ultimately stem from the employees' sense of responsibility and operational skills. It is necessary to truly cultivate a product quality awareness among employees, enhance their sense of responsibility and improve their operational skills. Production should be improved from all aspects such as components, tools and relevant systems to minimize and prevent the occurrence of substandard issues like false soldering and fake soldering to the greatest extent possible.

5What should I do if there is a graphic misalignment when using solder paste?
 Answer: Edge collapse that occurs during solder paste printing. This is closely related to the characteristics of the solder paste, the template, and the setting of printing parameters: the viscosity of the solder paste is relatively low, its shape retention is poor, and it is prone to edge collapse and bridging after printing. If the wall of the template hole is rough and uneven, the printed solder paste is also prone to edge collapse and bridging. Excessive scraper pressure will exert a relatively large impact force on the solder paste, damaging its shape and significantly increasing the probability of edge collapse. Countermeasures: Select solder paste with higher viscosity, use laser cutting templates, and reduce the pressure of the scraper

6When using solder paste, what should be done if there is too much?
 Answer: The main reason for the excessive quantity is that the template adjustment is not in place, resulting in an overly large size. If the distance between the steel plate and the printed circuit board is too large, bridging will occur. Before use, if the window is too large, it should be tested and adjusted. Set the parameters for the distance from the printed circuit board to the steel plate; Clean the template.

The above is what I have told you aboutSolder pasteSome problems that may occur during the usage process and their solutions can all be learned about by everyone. During the operation process, if this is an accident, some attention or changes can also be made. If there are still any unclear points, everyone is welcome to consult Shenzhen JJY Industrial Technology Co., LTD. Let's learn and grow together!