What are the causes of solder paste pilling?

Solder pasteisSMTThe most important solder in the patch. WithSMTWith the development of surface mount technology (SMT), the solder paste produced by JJY Solder Paste Factory is also a new type of electronic soldering material. It is a mud-like compound composed of a mixture of solder powder, flux paste, surfactant, thixotropic agent, etc.

Mainly used inSMTIndustry fieldPCBSurface mount resistors, capacitorsICElectronic soldering of electronic components, etc. WithSMTThe increase in the use of surface mount technology (SMT) has led to the emergence of new welding materials. The pilling of solder paste is caused by printing operation errors. So, what are the main reasons for the pilling of solder paste? Let's take a look at the following explanation from JJY solder Paste Manufacturer:

During the printing process, the thawing time is relatively long, the organic solvents are evaporated, and then the solder paste turns into powder and falls onto the circuit board. The high temperature of the soldering furnace causes boiling over.

The environmental humidity is relatively high. Dehumidification is necessary to prevent the appearance of tin beads.

Too many small particles;

The solder paste is oxidized and absorbs the excess moisture.

Uneven heating situation

The fast scraper speed and the deviation of the specific printing position are all reasons.

Generally speaking, the selection of solder paste is a rather important step. Choosing good solder paste and a reputable solder paste manufacturer can reduce many of your troubles.

JJY solder Paste Manufacturer mainly engages in lead-free solder paste.SMTSurface mount solder pasteLEDResearch, development, production and supply of solder pastes, lead-free solder wires, wave soldering rods and other solder solders. For more knowledge about electronic soldering, please contact us. Welcome to interact with us.