The causes and preventive measures of solder paste reflow solder joint voids

The appearance of the filling cavities inside the reflow solder joints is related to the incomplete evaporation of the flux. Improper control of the amount of flux used during the welding process can easily lead to the phenomenon of filling cavities. The appearance of a small number of voids will not have a significant impact on the solder joints, but a large number of them will affect the reliability of the solder joints. Now, Shenzhen JJYSolder paste manufacturerLet me introduce:

The causes of reflow solder joint voids:

1The proportion of flux in the solder paste is too high, making it difficult for it to completely escape before the solder joint solidifies;

2If the preheating temperature is too low, the solvent in the flux is difficult to completely evaporate and remains inside the solder joint, which will cause the phenomenon of filling voids;

3If the welding time is too short and the gas escape time is insufficient, it will also cause filling voids;

4Lead-free solder alloys generally have during solidification4%If the volume shrinks and the solidification area is located inside the solder joint, voids will also be produced;

5Organic substances that are contaminated during the operation process can also cause voids;

Measures to prevent reflow solder joint voids:

1Adjust the process parameters, control the preheating temperature and welding conditions well;

2The proportion of flux in the solder paste is appropriate;

3Avoid contamination during the operation process.

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