Analysis of the Causes of Solder paste not attaching solder and missed Soldering and Solutions

Solder pasteWelding plays a crucial role in the electronics manufacturing industry as it is a key link connecting electronic components with circuit boards. However, sometimes problems such as solder paste not being soldered or missing solder occur from time to time. This not only seriously affects production efficiency but may also lead to a decline in product performance and even the scrapping of an entire batch of products. To help everyone better understand and solve these problems, Shenzhen JJY Solder Paste Manufacturer will conduct an in-depth analysis of the reasons for solder paste not being soldered and missed soldering from multiple perspectives in the following text, and propose corresponding solutions.

I. Analysis of the Reasons for Solder Paste Not Attaching Solder and Solutions

(1) Solder paste quality issues

Prolonged use or expiration: Over time, the chemical components in the solder paste will change, leading to a decline in its performance. Expired solder paste often has an increased viscosity and a decreased flux activity, thereby affecting the soldering effect. The solution is to regularly check the expiration date of the solder paste and replace the expired products in a timely manner.

Steel mesh hole issue: If the holes in the steel mesh are too thin or the size is inappropriate, it may lead to insufficient tin leakage, thereby affecting the welding quality. The solution is to adjust the opening size and thickness of the steel mesh according to the actual needs.

(II) Welding temperature issues

Insufficient peak temperature: The soldering temperature is a key factor affecting the fluidity and wettability of solder paste. If the peak temperature does not meet the requirements, it may cause the solder paste to fail to melt fully, resulting in the phenomenon of no solder coating. The solution is to check and adjust the temperature Settings of the welding equipment to ensure that the appropriate peak temperature is reached.

Furnace temperature fluctuation: The instability of the temperature inside the furnace can also affect the welding effect. Temperature fluctuations may cause the solder paste to fail to maintain a stable liquid state during the soldering process. The solution is to monitor and stabilize the temperature inside the furnace and reduce the impact of temperature fluctuations on the welding process.

(3) Raw material issues

Component oxidation: The oxide layer on the surface of components can prevent good contact between solder paste and components, resulting in poor soldering. The solution is to clean or pre-treat the components before soldering to remove the oxide layer on the surface.

Poor quality of solder paste raw materials: If the metal powder or flux in the solder paste is of poor quality, it may also lead to the problem of solder not being soldered. The solution is to select high-quality solder paste raw materials and regularly check their quality.

Ii. Analysis of the Causes of Missed Solder Paste Soldering and Solutions

PCBPanel surface design issues

Unreasonable layoutPCBUnreasonable layout of components on the board surface may lead to shadow effects during the soldering process, thereby causing missed soldering. The solution is to fully consider the layout and arrangement direction of components during the design stage, adhering to principles such as placing small components at the front and avoiding mutual occlusion as much as possible.

Improper pad design: Pads that are too small in size or have an inappropriate shape may also lead to missed soldering. The solution is to rationally design the size and shape of the solder pads based on the specifications of the components and the soldering requirements.

Iii. Conclusion

To sum up, the problems of solder paste not being soldered and missed soldering may be caused by the combined effect of multiple factors. To effectively solve these problems, we need to consider aspects such as solder paste quality, soldering temperature, raw materials, andPCBConduct a comprehensive analysis and improvement in multiple aspects such as the panel surface design. Only in this way can the quality and stability of solder paste soldering be ensured, and the production efficiency and product qualification rate be improved.

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