How to solve the problem of uneven wire drawing during solder paste dispensing?

With the continuous development of electronic technology, many people haveSolder pasteI'm not particularly familiar with the dispensing process. However, in the manufacturing industry, this process plays a very important role and is widely applied in the manufacturing of automotive and mobile phone parts as well as the semiconductor industry. Although the production process of solder paste dispensing is relatively delicate, uneven wire drawing occurs during operation. So, how to solve this problem? Next, Shenzhen JJY Solder Paste Manufacturer will explain it to you:

One of the more common problems during the dispensing process is stringing. The following measures can be taken:

1Set the delamination delay. Due to the existence of a certain distance between the glue outlet of the glue nozzle and the glue valve, if the glue release delay is not set, it will result in some glue shortage points being unable to apply glue.

2Set the glue closing delay. When the glue head is closed, there is still a certain amount of glue between the glue valve and the glue outlet that has not been discharged. If the glue closing delay is not set, it will lead to the phenomenon of glue "trailing".

3Adjustment of wire drawing height. Due to the high viscosity of the solder paste, it needs to be raised a certain distance during the dispensing process to break the glue wire. When automatically adjusting, the height of the wire drawing needs to be adjusted according to the situation.

4Increase the height setting. To prevent poor dispensing of the product caused by the collision of the dispensing needle, the lifting height needs to be set.

5Close the reservation in advance to complete the final trajectory. To prevent the accumulation of rubber in the final stage products, it is necessary to set the rubber closure in advance.

6Pull it up diagonally. Due to the high viscosity of the solder paste, directly performing the wire drawing action after closing the glue cannot achieve the effect of breaking the glue wire, or the shape of the drawn glue wire does not meet the requirements. Therefore, after closing the rubber head, perform the diagonal pulling and lifting action to prepare for the wire drawing.

The above content is shared by Shenzhen JJY Solder Paste Manufacturer for you. We hope it will be helpful to you. If you want to know more about solder paste andSMTKnowledge of surface mount technology (SMT) processing. Welcome to leave a message and interact with us!