What are the causes of solder paste generating solder joint voids?

Generally, weSolder pasteWhen the dosage is not properly controlled, it is particularly easy to form solder joint voids. The formation of a small amount of voids does not cause significant harm to the solder joints, but once a large amount is formed, it will endanger the safety and reliability of the solder joints. So, what are the causes of the formation of solder joint voids in solder paste? Now, JJY solder Paste Manufacturer will explain it to you:

The reasons for solder paste generating solder joint voids:

1The proportion of the intermediate flux is too high to completely volatilize before the solder joint cures.

2If the preheating temperature is too low, the solvent in the flux cannot fully evaporate and will remain at the solder joint, thereby causing filling defects.

3This usually occurs when the solder alloy in lead-free reflow soldering solidifies4％If the volume shrinks and the final solidification area is located inside the solder joint, voids are very likely to occur.

4Organic substances that are contaminated during the operation process can also cause voids.

5If the welding time is too short and the gas escape time is insufficient, it will also cause filling cavities.

Preventive measures for solder paste causing solder joint voids:

1Adjust the process parameters, control the preheating temperature and welding conditions well;

2The proportion of flux should be appropriate.

3Avoid contamination during the operation process.

Produced by Shenzhen JJY Solder Paste FactoryLEDSpecial solder paste is strictly controlled during the production process, with Wuxi beads and a low porosity rate. If you needLEDFor specialized solder paste and other types of solder paste, please contact us for consultation. We will share more valuable knowledge with you.