Solder paste manufacturers briefly discuss in what environment high-temperature lead-free solder paste works best?

Friends who have used soldering all knowLead-free solder pasteThere are high and low temperatures. Lead-free high-temperature solder paste is undoubtedly used at high temperatures. The difference between high-temperature lead-free solder paste and low-temperature lead-free solder paste lies in their melting points. Lead-free high-temperature solder paste is composed of tin, silver and copper. At low temperatures, it is tin and bismuth, and its low-temperature melting point is139High temperature217. Therefore, if it is necessary to distinguish between these two furnace temperatures, both types of solder pastes can be passed through the furnace, and the temperature curve of the reflow soldering can be set to low-temperature solder paste. If there is one that falls off severely or doesn't stick at the back of the furnace, it is high-temperature lead-free solder paste, because the melting point of high-temperature lead-free solder paste is217The maximum temperature of low-temperature solder paste might be220It just reaches the high-temperature melting point, so if the tin cannot be melted, it will cause the component to drop. So, in what environment does high-temperature lead-free solder paste work best? The solder paste manufacturer will explain it to you below:

After high-temperature lead-free solder paste is printed, it must be reflow four hours in advance if it has been left for a relatively long time,The solvent will vaporize and its viscosity will decrease, which will weaken the solderability of the components or cause soldering problems after moisture absorption, especially on circuit boards with silver conductors. If the solder paste is printed in a high-temperature environment such as a normal temperature of 30 degrees Celsius and an air humidity of 80% in summer, the soldering force will become very low after being placed aside for reflux.

If the solder paste is blown, the solvent will vaporize, reducing the viscosity and causing the epidermis to protrude. So it is necessary to avoid the air conditioner and the electric fan blowing on the solder paste simultaneously.

Lead-free high-temperature solder paste is also adversely affected by air humidity and indoor temperature. Therefore, it is advisable to operate in an environment with a normal temperature of 23 to 24 degrees Celsius and an air humidity of 50%. The viscosity of the solder paste can be optimized to an appropriate level within the range of 23 to 24 degrees Celsius. Thus, if the indoor temperature is too high, the viscosity will be very low; if it is too low, the viscosity will be too high. This makes it difficult to achieve satisfactory results after printing. Due to the moisture absorption relationship of solder paste, in high-temperature and humid weather, solder paste will absorb water from the indoor air, causing solder balls and spatter.

Everyone should have a deeper understanding of the melting point and application environment of lead-free high-temperature solder paste. Many people are already quite clear about how to ensure the best state of lead-free high-temperature solder paste. If you still have any questions or want to learn more about soldering knowledge, please continue to follow the online message of JJY solder Paste Factory to interact with us.