Solder paste manufacturers tell you: How to deal with wrongly printed solder paste?

When we print solder paste, sometimes it is inevitable that incorrect prints will occur. So what should we do? Today, the solder paste manufacturer will tell you how to deal with this situation.

Generally speaking, we often use a small scraper to scrape off the solder paste from the wrongly printed board, but this method may causepcbCertain conditions occurred on the circuit board. The most reliable method is to place the wrongly printed board in a certain solvent and gradually remove the wrongly printed tin from the board with a soft brush. Do not brush it dry vigorously; instead, scrape it off. After soaking, frequently rinsing with a light spray can effectively remove unwanted solder paste. It is also recommended to choose hot air drying. Generally, a horizontal template cleaning machine is used. The side to be treated should face down to be able to accept the solder paste falling off the board. Try to avoid wiping with cloth strips to prevent solder paste and other contaminants from being smeared on the outer surface of the board.

In addition, keeping the appropriate small tools clean before solder paste printing can also reduce the risk of solder paste misprinting. During the printing process, the template is wiped regularly in a certain proportion between the printing cycles. To ensure that the template is placed on the pad, not on the solder mask layer, it is necessary to guarantee a clean solder paste printing production process. Online and real-time analysis of solder paste related inspection, electronic component mounting, and subsequent refluxes for previous inspection work is actually a process operation step that reduces the impact of previous production process defects during soldering.

Warm reminder: AtSolder pasteAfter printing, the longer the waiting time for cleaning the misprinted solder paste is, the more difficult it is to remove the misprinted solder paste. Therefore, once a misprint occurs, it should be removed before the solder paste dries.