Is it because the solder paste does not apply solder due to insufficient activity?

As is known to all, sometimesSolder pasteIt is not tinned because of insufficient activity. Some people would also say that the more activity, the better. Is it sometimes because of insufficient activity that solder paste doesn't coat? In that case, do you think the higher the activity of the solder paste, the better? Next, let's have the Shenzhen solder paste manufacturer analyze it for everyone:

Everyone knows that there are many additives in solder paste, among which one is called an active agent. The active agent is the key solvent that determines the activity of the solder paste. The activity level of the solder paste is related to the amount of active agent added. Generally, if the tin coating ability is poor, it is because the activity is too low. Perhaps some people would say, "Then just add a little more activator. This way, the solder paste will definitely work well!" In fact, this is wrong.

Active agents have a relatively corrosive and irritating effect. If too much active agent is added to the solder paste, even ifSMTWhen reflow the printed surface mount, tinning is expected to have a better effect, but it is correctPCBThe board has a relatively corrosive and irritating hazard, which can damage the path and thereby reduce itPCBThe service life is not worth it.

Therefore, the activity of solder paste is not the higher the better; rather, a moderate level of activity is sufficient. In addition, the same goes for other additives in solder paste. One should not blindly pursue an effect by adding too much, while ignoring the adverse effects brought by excessive addition.

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