How to solve the problem of bubbling after lead-free solder paste application?

Lead-free solder pasteHow to solve the foaming problem after application? When everyone is working with lead-free solder paste, there are always many problems of bubbling. Solder joint bubbles not only undermine the stability of solder joints but also continuously increase the probability of component failure. When using lead-free solder paste, the bubbles in the solder joints serve as heat storage areas during the operation of electronic devices. The heat generated by the operation of electronic devices can cause bubbles. So, how should such a situation be solved? Let's talk about it with you from the editor of JJY Solder Paste Factory:

Expected to be in use SACWhen using aluminium alloy, to achieve better humidity and final connectivity, compare it with the flux in it. SACThe flux in the solder paste must operate at a relatively high ambient temperature, and SACThe interfacial tension of aluminium alloy is higher than that of tin-aluminium alloy. Volatile organic compounds are all collected in the molten solder.

1After electric welding, in the stage before cooling, gradient direction vacuum packaging is carried out, that is, the vacuum value gradually increases, as the solder is still in liquid state after electric welding. At this point, the bubbles are dispersed in every part of the solder joint. Gradient direction vacuum packaging can first suck away the bubbles on the surface layer, and the bubbles at the bottom will move upwards. With the reduction of work pressure, bubbles will overflow evenly. If the gas is discharged immediately, there will be an explosion opening left on the solder joint.

2Pre-evacuating. Before heating lead-free solder paste, the operation area should be drained completelyco2To prevent the formation of an air oxide film during the entire heating process of the solder. Vacuum can also increase the total wet area.

inLead-free solder pasteBefore heating, first expel the oxygen from the working area to prevent the formation of an air oxide film during the heating process. When welding, it can also increase the wet area of the pad. Therefore, during the usage process, we still need to be cautious and not be too hasty to cause unnecessary trouble.

Shenzhen JJY has carried out mutually beneficial cooperation with electronic raw material producers. At the same time, it also produces solder wire, solder bar, solder paste and flux paste for other enterprises. With a rich variety of successful cases in the research and development of chemical raw materials, our overall strength has created a sales market that is of high quality and honest and trustworthy.