A brief introduction to the technical points to note during lead-free solder paste soldering

Each applicationLead-free solder pasteAll electronic factories hope to help electronic products achieve a perfect soldering. However, this is not a very simple matter. To achieve such an effect, several key points must be met. Now, the solder paste manufacturer will explain them to you:

Technical introduction that requires special attention during lead-free solder paste printing:

1Before printing, it is necessary to check daily necessities such as the scraper and steel mesh. Make sure it is clean and tidy, free of dust and any debris (clean thoroughly if necessary) to prevent lead-free solder paste from being contaminated and directly affecting its solventability. The blade of the scraper should be straight and free of defects. The steel mesh should be straight with almost no deformation. There must be no residual tin paste, hard lumps or other debris at the edge of the groove.

2The base plate should be fixed with fixtures or vacuum devices to prevent it from being used during the printing processPCBIt can cause offset and enhance the separation effect of the steel mesh after printing.

3Connect the steel mesh withPCBAdjust the positions between them to fit as well as possible (large gaps can lead to solder leakage, and misalignment in the horizontal direction can also cause solder paste to be printed outside the solder pad).

4When printing is just beginning, the amount of lead-free solder paste added to the steel screen should not be too much. MostA5Steel mesh plus200g,B5Steel mesh plus300g,A4Steel mesh plus400g;

5As the printing production operation continues, the amount of lead-free solder paste on the steel mesh will significantly decrease. At an appropriate time, a certain amount of high-quality lead-free solder paste should be added.

When using lead-free solder paste to solder any soldering surface, a full and neat appearance is required, especially in terms of surface gloss.

The soldering temple of lead-free solder paste has no omissions or unsoldered areas. Lead-free solder paste will not cause problems such as false soldering, monument standing, continuous soldering or residue due to overheating or insufficient working temperature.

Lead-free solder paste penetrates the bonding area in multiple aspects. Can the entire exposed part of the circuit board be covered with lead-free solder paste?

If there are any joints in the soldered parts of the raw and auxiliary materials and lead-free solder paste, they must not deteriorate or be damaged due to heating.

The rosin in lead-free solder paste must not disperse and invade the contact areas or leave excessive gaps.

These are some knowledge related to lead-free solder paste printing technology collected and sorted out by the editor. I hope they can be helpfulPCBorLEDIt is helpful for electronic manufacturers. For more information and news about lead-free solder paste, please pay attention to the official website of JJY.