Shenzhen solder paste manufacturerThere are many. Solder paste is generally divided into lead-free and leaded types, and its uses usually includeLEDThe automotive industry and electronics industry products, the application of diode light emission, and many specific welding conditions related to this product have all been clarified first. Lead solder paste printing has good rolling and tin dropping properties, and is suitable for low to0.4mmThe pitch pads can also achieve exquisite printing. Leaded solder paste can meet the requirements of different grades of soldering equipment. It does not need to complete soldering in a nitrogen-filled environment and still shows good soldering performance within a wide reflow oven temperature range,Use heating up---Insulated type or Stepwise heating type Both types of furnace temperature setting methods can be used. Lead-containing solder paste leaves very little residue after soldering, has a very light color and a relatively large insulation resistance, and will not corrodePCBIt can meet the requirement of being washable ; Leaded solder paste is of better qualityICTTest performance and there will be no misjudgment. It can be used for coating through hole rollers.
The tin powder particles of the solder paste we generally use are20-45umBetween, it is divided into3#with4#For powder, manufacturers can choose solder paste that suits the size of their tin powder particles according to their product requirements.
The main functional components include: matrix, demolding agent and surfactant.
The matrix is the main component of leaded solder paste, controlling the melting point of the leaded solder paste. After melting, it covers the surface of the solder joint, playing a role in isolating air. At the same time, it is also the solvent for other functional components.
Demolding agents remove, break or loosen the surface oxide film of the base material through physical and chemical processes, allowing the molten filler metal to wet the fresh surface of the base material.
Surfactants can further reduce the interfacial tension between the molten filler metal and the base metal, promoting better spreading of the molten filler metal on the surface of the base metal.
Surfactant(surfactant)It refers to the addition of a small amount of a substance that can cause a significant change in the interface state of its solution system. It has fixed hydrophilic and lipophilic groups and can be directionally arranged on the surface of the solution. The molecular structure of surfactants is amphiphilic: one end is a hydrophilic group and the other end is a hydrophobic group.
The solder paste of Shenzhen JJY brand has gone through many years12A solder paste and wire manufacturer specializing in the annual research and development of solder paste, solder wire, solder wire, lead-free solder paste, leaded solder paste, solder rods, leaded solder paste, etc. Choose the solder paste manufacturer of JJY brand for solder paste.