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Which lead-free solder paste manufacturer in Shenzhen supplies Sn96.5Ag3.0Cu0.5

Return to List source: JJY Release Date: 2021.09.18

There are many types of solder paste available on the market now, and they are classifiedLead-free solder pasteAnd lead-containing solder paste are basically all at high temperatures270-280℃Lead-free high-temperature solder paste is a lead-free high-temperature high-melting-point solder paste specifically designed for the packaging and soldering of precision components in power semiconductors, with an actual melting point270℃(Note: The peak temperature of reflow soldering is required.300℃The above meets the requirements of the automated dispensing process and printing process. It is applicable to the packaging and soldering of products such as power tubes, diodes, transistors, rectifier Bridges, and small integrated circuits. It has an extremely low porosity and meets the requirements of secondary reflow.

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Lead-free high-temperature solder pasteLFP-5H-305It uses a special formulaRMAA uniform spherical lead-free solder paste with very little oxide contentSn96.5Ag3.0Cu0.5A uniform mixture of tin powder. This product has passedSGSTest compliantRoHSThe instructions contain solder paste that complies with the standards of the United StatesQQ-571As stipulated in itRMAType. This product strives to be highly compatible with the soldered product, with moderate wettability (activity), firm, bright and full solder joints, no solder beads, bridging, false soldering, less residue after soldering, high insulation resistance, good dry resistance, small viscosity change during continuous printing, ensuring the stability of long-term operation printing, good thixotropy and demolding property, good shape retention after printing, not easy to collapse, and components do not shift.


Product Features:

1 The weld points are firm, bright and full 12With years of R&D and production experience, we have scientifically mastered modern process formulas, ensuring that the solder paste is highly compatible with the soldered products. The solder joints are firm, bright, uniform, full and free of solder beads.

2Low residue, no need for cleaning We have developed and formulated a no-wash environmentally friendly flux, which leaves little residue after welding, has high insulation resistance, a clean board surface without corrosion, and forms a protective layer to prevent the substrate from oxidizing again.

3 It has strong wettability and good tin crawling High-performance thixotropic agents are added to the solder, making the solder paste highly active. The molten solder paste significantly wets the solder pad, reducing the phenomenon of false soldering during the soldering process.4 It features stable printing and good demolding performance The tin powder particles have good roundness and uniform size. During printing, there is no trailing, sticking or splashing phenomenon. There is no collapse, sharp or continuous tin connection during molding. The viscosity change is small during continuous printing, and it does not dry out. The components do not shift.

 The solder paste of Shenzhen JJY brand has gone through many years12Annual research and development of solder paste, solder wire, soldering wireLead-free solder pasteManufacturers of leaded solder paste, solder rods, leaded solder paste and other solder paste and wire products. Choose the solder paste manufacturer of JJY brand for solder paste.


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Brand:JIAJINYUAN/JJY Model:LFP-JJY5RQ-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:190±20Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle
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Brand:JIAJINYUAN/JJY Model:LFP-JJY5RNTT-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:170±20)Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle

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