The causes and handling methods of component displacement during SMT processing

With the development of science and technology and the improvement of people's living standards, the pursuit of electronic products is becoming smaller and more precise, andSMTThe tradition in small-batch surface mount technology (SMT) processing plantsDIPThe plug-in is small and compactPCBAThe role in it is no longer as goodSMTSurface mount technology (SMT) processing, especially large-scale and highly integrated onesIC. In the precision industry, whether it is the use of materials or the processing steps, extremely meticulous care is required. This is because any slight error in the precision industry can lead to the entire equipment being unusable. Therefore, when conducting surface mount technology (SMT) processing, during the SMT processing,The reasons for the movement of components can be identified from the following aspects. BelowSolder paste manufacturerLet me explain it to everyone:

I. Main Reasons

1The solder paste itself does not have much viscosity and is not strong enough to bond. However, during the handling process, problems such as vibration and shaking may occur, which leads to the displacement of components.

2The content of flux in the solder paste is high, and the flux flow rate is relatively large during the soldering process, which leads to the displacement of components.

3During the surface mount technology (SMT) processing, the air pressure at the machine's suction nozzle was low and not properly adjusted, resulting in insufficient air pressure and thus causing component displacement.

4,smtThe surface mount technology (SMT) machine itself had quality issues that were not repaired in time, causing the components to be placed in incorrect positions and thus leading to component displacement.

Ii. Handling methods for the causes

1Use solder paste with a high degree of adhesion and good quality to enhance the bonding force of component mounting.

2Select the appropriate solder paste to prevent problems such as solder paste collapse. When choosing solder paste, check if there is an appropriate amount of flux.

3During the debugging process, be meticulous and careful to adjust the air pressure of the machine's suction nozzle properly, thereby enhancing the performance of the componentssmtMounting pressure

4Regularly check the quality of the machine, promptly identify potential quality hazards, strictly calibrate the positioning coordinates, and ensure the accuracy of component mounting.

In fact,smtIn the reflow soldering process of surface mount technology (SMT) processing, apart from the displacement of components, there are many other undesirable phenomena,However, all these adverse phenomena can be avoided or even resolved. From the very beginning of circuit board design, choose the responsible onessmtThe surface mount technology (SMT) processing factory will do every step of the processing well and select the appropriate and high-quality solder paste at the same time, thereby fundamentally improving the quality of reflow soldering and preventing the deviation of components.

The above aboutSMTThe content about the causes and handling methods of component displacement during processing. If you want to know more about solder paste products, please follow Shenzhen JJY Solder Paste Factory and interact with us.