What should be done if there is poor tin penetration in SMT?

inSMTIf poor tin penetration occurs during contract manufacturing and material supply, we need to pay sufficient attention to it. Poor tin penetration will affect the subsequent processSMTThe soldering steps in surface mount technology (SMT) processing may lead to a series of problems such as false soldering. The following is JJYSolder paste manufacturerHere is a brief introduction to some reasons that may affect tin penetration during production and processing:

I. Materials

High-temperature molten tin has strong permeability, but not all soldered objects can penetrate it. Some metals have a dense protective layer on their surfaces, and if there is an oxide layer on the surface of the soldered metal, it will also prevent the penetration of molecules.

Ii. Flux

Flux has an impactSMTOne very important factor in processing solder penetration is that flux mainly serves to remove surface oxides from circuit boards and surface mount components and prevent re-oxidation during the soldering process. Poor selection of flux, uneven application, and insufficient amount will all lead to poor solder penetration.

Iii. Wave Soldering

inSMTPoor tin penetration in contract manufacturing and material supply is naturally directly related to the wave soldering process. In order to optimize the soldering parameters of poor tin penetration, it is necessary to re-optimize parameters such as wave height, temperature, soldering time or moving speed.

Four. Manual welding

In realitySMTIn the quality inspection of processed plug-in welding, a considerable number of welded parts only have the surface solder form a conical shape, but no solder penetrates into the through-hole. In functional tests, it is confirmed that many of these parts are false soldered. This situation is more common inSMTIn the manual soldering of OEM and material supply, the reasons are inappropriate soldering iron temperature and too short soldering time.

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