What are the common faults of SMT solder paste printers? How to solve it?

We often saySMTThere are many common faults in solder paste printers. These problems trouble many staff members. When encountering these problems at work, they don't know how to deal with them, which leads to low work efficiency. However, what about the printerSMTThe essential production equipment in the processing and manufacturing industry. Regarding this phenomenon, it is believed that it will become a topic of discussion for many viewers. So, how should we solve these problems? Let's take a look at JJYSolder paste manufacturerLet me lead everyone to learn about:

smtCommon faults in solder paste printing:

1Diagnosis and treatment of tin soldering

(1Phenomenon description: There is a small amount of solder paste connecting between the two solder pads. During high-temperature welding, it is often pulled back by the main solder bodies on each pad. Once it cannot be pulled back, it will cause a short circuit in the solder balls or the circuit, resulting in poor welding.

(2Tinning diagnosis: insufficient tin powder, low tin powder viscosity, large tin powder particle size, high room temperature, too thick printing, high placement pressure, etc.

(3Soldering treatment: Increase the proportion of metal components in the solder paste; Increase the viscosity of the solder paste; Reduce the particle size of tin powder; Reduce the ambient temperature; Reduce the thickness of the printed solder paste; Enhance the accuracy when printing solder paste; Adjust various construction parameters of solder paste; Reduce the pressure applied to the parts; Adjust the temperature curves of preheating and fusion welding.

2Diagnosis and treatment of tin infiltration

(1Phenomenon description: After printing, there are burrs or excess solder paste near the solder paste.

(2Tin infiltration diagnosis: Insufficient pressure of the scraper, too small Angle of the scraper, excessive opening of the steel meshPCBandPADThe size is too small, the printing is not aligned properly, the parameters of the printing machine are set incorrectly, and the steel mesh andPCBThe bonding is not tight and the viscosity of the solder paste is insufficient.PCBOr the bottom of the steel mesh is not clean, etc.

(3Tin infiltration treatment: Adjust the parameters of the solder paste printer; Clean or replace the template, clean or replacePCB; Improve the accuracy of the printing press; Increase the viscosity of the solder paste.

3Diagnosis and treatment of solder paste collapse and powdering

(1Phenomenon description: Solder paste is presentPCBThe molding on it is poor, the printing height is inconsistent, and the solder paste is in powder or granular form.

(2Diagnosis of solder paste collapse and powdering: Excessive solvent in the solder paste, excessive solvent when wiping the bottom of the steel mesh, solder paste dissolving in the solvent, the wiping paper not rotating, poor quality of solder pastePCBThe printing was left in the air for too long.PCBExcessively high temperatures, etc.

(3Solder paste collapse and powdering treatment: Increase the proportion of metal components in the solder paste; Increase the viscosity of the solder paste; Reduce the particle size of tin powder; Reduce the ambient temperature; Reduce the thickness of the printed solder paste; Enhance the accuracy of the seal paste; Adjust various construction parameters of solder paste; Reduce the pressure applied when the parts are placed; Avoid using solder paste and after printingPCBLeft in damp air for a long time; Reduce the activity of the flux in the solder paste; Reduce the lead content in metals.

4Diagnosis and treatment of solder paste sharpening

(1Phenomenon description: Solder paste is presentPCBThe molding on it is poor, the coating area is too large, and the distance between the weld points is too small.

(2Diagnosis of solder paste sharpening: The holes in the steel mesh are not smooth, the size of the holes in the steel mesh is too small, and the demolding speed is unreasonable.PCBThe solder joints are contaminated, the solder paste quality is abnormal, and the steel mesh is not wiped clean, etc.

(3Solder paste sharpening treatment: Clean or replace the steel mesh; Clean or replacePCB; Adjust the printing parameters; Replace the solder paste with better quality.

To master the relevantSolder pasteWe warmly welcome all friends to consult Shenzhen JJY Industrial Production High-tech Co., Ltd. for problems related to soldering methods such as flux paste, lead-free solder paste, and solder paste. Let's learn and grow together!