What are the reasons for the solder paste not being fully coated during SMT assembly?

SMTDuring the surface mount technology (SMT) process, everyone knows that one of the crucial steps is soldering with tin. If the solder on the solder joints is not full, it will have a very serious impact on the performance and aesthetic appearance of the circuit board. Therefore, it is necessary to avoid the situation where tin is not full as much as possible. Now, let's have Jia JinyuanSolder paste manufacturerLet me give you a detailed introductionSMTWhat are the reasons for the incomplete soldering in the surface mount technology (SMT)?

First, if the wetting performance of the flux used when soldering solder paste does not meet the standard, the solder will not be full during the soldering process.

Secondly, if the flux in the solder paste is not active enough, it cannot be removed betterPCBThe oxide substances on the solder pads and component pins can also have a certain impact on soldering.

Thirdly, if the expansion rate of the flux is very high, the phenomenon of easy voids will occur.

Fourth, ifPCBSolder pad orSMDIf there is a relatively severe oxidation phenomenon at the soldering position, it will also affect the tinning effect.

Fifth, if the amount of solder paste used during the soldering process is too small, it will also result in insufficient soldering, causing voids. This mistake is something that no experienced operator would make.

Sixth, if the solder paste is not thoroughly stirred before use and the flux and solder powder are not fully mixed, it will also lead to the solder at some solder joints not being full.

Let JJY's solder paste technology assist you in solving the problemsmtThe problem of insufficient tin filling! If you have any other questions, please feel free to consult us to learn more about professional solutions for solder paste.