How to avoid poor soldering on smt patches?

SMTThere is a very important step in surface mount technology (SMT) processing, and that is soldering. If not professionalsmtThere may be adverse conditions such as insufficient soldering, which directly affect the appearance and even performance of the circuit board, threatening the service life of the product. To avoid the occurrence of poor tinning, it is first necessary to know the causes of these poor phenomena and solve them from the source. The following is JJYSolder paste manufacturerHere is a brief introduction to the reasons for poor tin coating:

1.smtIf the wetting performance of the flux used in the processing does not meet the standard, the solder coating will not be full when soldering.

Second, if the flux in the solder is not active enough, it cannot be removed betterPCBThe oxidized substances on the solder pads.

Thirdly, during the production process of surface mount technology (SMT) processing, if the surface tension of the flux is very high, it is prone to the occurrence of voids.

4. Solder pads orSMDThere is a relatively serious oxidation phenomenon at the welding part.

If the amount of tin used in the soldering process is too small, it will also result in insufficient tin coating and the occurrence of voids.

Six. Before use, has the tin been thoroughly stirred, and have the flux and tin powder been fully mixed?

In progressSMTWhen performing surface mount technology (SMT) processing, it is necessary to avoid the above-mentioned situations that may cause insufficient tin filling, thereby effectively preventing the problem of insufficient tin filling to the greatest extent. If you have any further needs or technical questions regarding soldering, please follow the online message of JJY Solder Paste Factory to interact with us.