What are the reasons for insufficient solder filling during SMT patch rapid prototyping?

SMTIn the rapid prototyping process of surface mount technology (SMT), everyone knows that one of the important steps is soldering with tin. If the solder on the solder joints is not full, it will have a very serious impact on the performance and aesthetic appearance of the circuit board. Therefore, when closing, try to avoid the situation where the tin is not full. Now, let's have Jia JinyuanSolder paste manufacturerLet me give you a detailed introductionSMTWhat are the reasons for insufficient soldering during rapid prototyping of surface mount technology (SMT)?

First, if the wetting performance of the flux used when soldering solder paste does not meet the standard, the solder will not be full during the soldering process.

Secondly, if the flux in the solder paste is not active enough, it cannot be removed betterPCBThe oxidized substances on the solder pads will also have a certain impact on tin.

Thirdly, if it is carried out in ShanghaiSMTWhen rapid prototyping of surface mount technology (SMT) is carried out, if the expansion rate of the flux is very high, the phenomenon of easy voids will occur.

Fourth, ifPCBSolder pad orSMDIf there is a relatively severe oxidation phenomenon at the soldering position, it will also affect the tinning effect.

Fifth, if the amount of solder paste used during the soldering process is too small, it will also result in insufficient soldering, causing voids. This mistake is something that no experienced operator would make.

Sixth, if the solder paste is not thoroughly stirred before use and the flux and solder powder are not fully mixed, it will also lead to the solder at some solder joints not being full.

Let JJY's solder paste technology assist you in solving the problemsmtThe problem of insufficient tin filling during rapid prototyping! If you have any other questions, please feel free to consult us to learn more about professional solutions for solder paste!