The commonly used types of solder paste in SMT assembly

inSMTIn surface mount technology (SMT) processingSolder pasteIt is an indispensable processing material. Solder paste, also known as solder paste, is mainly used toSMTThe new type of soldering material used for surface mount technology is generally a paste mixture formed by the mixture of solder powder, flux, and other surfactants, thixotropic agents, etc. DifferentPCBADifferent solder pastes will be used in processing requirements. So, what types of solder pastes are there? Below is Shenzhen JJYSolder paste manufacturerLet me briefly share with you the types of solder paste:

I. Whether it contains lead

inSMTDuring processing, solder paste is generally classified into leaded solder paste and lead-free solder paste based on whether it contains lead. Leaded solder paste poses a greater threat to the process and human health. HoweverSMTThe surface mount soldering effect is good and the cost is low. The lead-free solder paste contains only trace amounts of lead, which is less harmful to the human body. It is an environmentally friendly product and is applied in environmentally friendly electronic products.

Ii. Melting Point

In realityPCBAIn processing and production, solder paste is generally classified into high-temperature solder paste, medium-temperature solder paste and low-temperature solder paste based on its melting point.

1High-temperature solder paste refers to the lead-free solder paste commonly used, with a melting point generally at217°CThe above The welding effect is good.

2Medium-temperature solder paste, the commonly used lead-free medium-temperature solder paste has a melting point of170°CThe main feature of medium-temperature solder paste is the use of imported special rosin,Good adhesion,It can effectively prevent collapse.

3The melting point of low-temperature solder paste is138°C,Low-temperature tin mainly contains bismuth, which is unbearable for surface mount components200°CWhen the temperature is above and the surface mount reflow process is required, low-temperature solder should be used for solderingⅠIt serves to protect the components that cannot withstand high-temperature reflow solderingPCB,Very much.LEDIndustry welcome.

Iii. Size of tin powder particles

According to the particle diameter of tin powder, solder paste can be classified as1,2,3. 4,5,6Grade solder paste, among which3,4,5The most commonly used one is the number of followers.

The more precise the product is, the smaller the tin powder needs to be. However, the smaller the tin powder is, the corresponding increase in the oxidation area of the tin powder will also be. In addition, the circular shape of tin powder is conducive to improving the quality of printing.

SMTThe higher the difficulty of the product in surface mount technology (SMT) processing, the more important the selection of solder paste becomes. Only solder paste that meets the product requirements can effectively reduce printing defects, improve the quality of reflow soldering, and lower production costs. JJY16For many years, we have been dedicated to the research and development, production and sales of solder paste, solder wire, solder bar, flux paste and other solder materials, providing customers with a complete set of electronic soldering solutions. We always adhere to the goal of ensuring high-quality products and creating benefits for customers by solving problems. While doing well in the domestic market, we have also been committed to expanding overseas markets, enhancing our brand competitiveness and achieving win-win cooperation.