What should I do if the solder on SMT patch processing spot soldering is not smooth?

inSMTIn the process of surface mount technology (SMT) processing, soldering and tin application is a crucial stage, which is related to the performance indicators and aesthetic appearance of the circuit board. During actual production, poor tin application may occur due to some reasons, such as the common spot soldering and tin application not being smooth, which can directly affect the situationSMTThe quality of surface mount technology (SMT) processing. Below is Shenzhen JJYSolder paste manufacturerLet me give you a detailed introductionSMTThe reasons for the solder not being smooth during spot soldering in surface mount technology processing:

SMTThe key reasons for the solder not being smooth during spot soldering in surface mount technology processing:

1The wettability of the flux in the solder paste is not very good and should not exceed the very good soldering requirements;

2The specificity of the flux in the solder paste is insufficient and it cannot be removedPCBSolder pad orSMDAir oxidation chemical substances at the welding position in electric welding;

3If the expansion rate of the flux in the solder paste is too high, cracks are very likely to occur;

4,PCBSolder pad orSMDThere is a relatively serious oxidation condition at the electric welding position, which affects the actual effect of tinning.

5The amount of solder paste at the spot welding position is insufficient, resulting in uneven soldering and the appearance of a notch;

6If the solder in some spot welds is not smooth, the reason will be that the red glue was not adequately mixed before application, and the flux and solder powder could not be fully combined;

7When passing through the reflow soldering oven, if the heating time is too long or the heating temperature is too high, it will result in the specific ineffectiveness of the flux in the solder paste.

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