Common methods for removing misprinted solder paste in SMT assembly factories

SMTIn the production process of surface mount technology (SMT) processing, solder paste needs to be printed first. Over a long period of timeSMTPatchSolder pasteOccasionally, solder paste may be misprinted during the printing process. Below, Shenzhen JJY Solder Paste Factory will briefly introduce to you the common methods for removing misprinted solder paste:

In the actual production and processing, if the solder paste is directly scraped off after a misprinted solder paste occurs, some problems that affect the production quality may arise. Under normal circumstances, it is generally necessary toPCBPut it in a special solvent and then use a tool like a soft brush to remove the solder pastePCBRemove it from the surface and then clean it once again. During the cleaning process, do not apply excessive force. After soaking, it can be removed by rinsing with a mild sprayPCBSome marks remaining on the board were then dried with hot air. If a horizontal template cleaning machine is used, the surface to be cleaned should face down to facilitate the detachment of solder paste from the board.

SMTMethods for preventing solder paste defects in surface mount technology (SMT) processing plants:

During the solder paste printing process, the steel mesh needs to be printed with solder paste in accordance with the process requirements, and it is necessary to ensure that the holes of the steel mesh are aligned with the corresponding solder pads. Online, real-time solder paste inspection and inspection before reflow after mounting are very helpful in reducing process defects before soldering.

JJY Solder Paste Manufacturer mainly engages in lead-free solder paste.SMTSurface mount solder pasteLEDThe research and development, production and supply of solder paste. For more knowledge about electronic soldering, you can follow and contact us. Welcome to interact with us.