How to avoid the problem of false soldering in SMT assembly?

inSMTAmong the OEM materials for surface mount technology (SMT) processing, quality inspection is the most important, and appearance quality isSMTThe most obvious and intuitive item in the processing of OEM materials. Even for some poor processing phenomena, there is no need for professional inspection. Just hold it in your hand and you can know where the problem lies. Generally speaking, electronicsOEMThe inspection of appearance quality during processing mainly focuses on components and circuit soldering. Regarding components, the main concern is whether there are any mistakes or omissions. As for circuit soldering, the main issues are false soldering and short circuits, especially false soldering, which requires careful inspection. In a circuit board, the problem of false soldering is rather serious because it may lead to the circuit board being able to be used normally during the inspection process, but suddenly having poor contact after being used for a period of time without obvious appearance issues.

So, how can the problem of false soldering be avoided? The following is JJYSolder paste manufacturerLet me share it with you all.

I. Judgment Method:

1The inspection is carried out by using dedicated online testing equipment.

2Visual orAOIInspection. When discoveredSMTThe solder at the solder joints of the surface mount is too little or the solder wetting is poor, or there are broken seams in the middle of the solder joints, or the surface of the solder is convex spherical, or the solder andSMDIf there is no issue of batch false welding, it should be taken seriously. Even minor phenomena can cause hidden dangers. It is necessary to immediately determine whether there is a problem of batch false welding.

Ii. Solution:

1If the printed solder paste on the circuit board is scratched or rubbed, the amount of solder paste on the pads will decrease, resulting in insufficient solder. It should be replenished in time.

2The through hole of the pad isPCBOne major flaw of the design is that through holes can cause solder loss, resulting in insufficient solder. The pad spacing and area also need to be standardly matched; otherwise, the design should be corrected as soon as possible.

3,SMTWhen oxidation occurs on the circuit board during the surface mount technology (SMT) process, the oxide layer needs to be removed. If the circuit board gets damp and there is any suspicion, it can be dried in a drying oven. If the circuit board is contaminated with oil stains, sweat stains, etc., it should be cleaned thoroughly with anhydrous ethanol at this time.

Shenzhen JJY Industrial Technology Co., Ltd. mainly engages in the production and operation of:SMTSolder paste manufacturers of solder paste, syringe solder paste, lead-free solder wire, wave soldering bar, automatic soldering wire, etc.