What are the main functions of SMT red adhesive and what are its purposes and functions?

SMTRed glue What are its main functions and what are its purpose and functions? GeneralSMTSurface mount adhesive is usually red(There are also yellow or white ones)The paste is evenly distributed with hardeners, pigments, solvents and other adhesives. It is mainly used to fix surface mount electronic components on the printed circuit board. Generally, it is distributed by dispensing or steel screen printing methods. After the components are pasted, they are placed in an oven or reflow oven for heating and hardening. It is also called surface mount adhesive. It is different from the so-called solder paste. Once it is heated and hardened, it will not melt even when heated again. That is to say, the thermal hardening process of the surface mount adhesive is irreversible. Now, the editor of JJY Factory will introduce it to youSMTThe reasons for using red adhesive in surface mount technology (SMT) processing.

SMTRed adhesive for surface mount technology (SMT) processing is a chemical compound, with its main component being high molecular materials. Surface mount processing fillers, curing agents, other additives, etc. The red adhesive for surface mount technology (SMT) processing has viscosity, fluidity, temperature characteristics, wetting properties, etc. Based on this characteristic of the red adhesive in surface mount technology (SMT) processing, inSMTIn the production process of a surface mount technology (SMT) processing factory, the purpose of using red glue is to ensure that the parts are firmly adhered toPCBPrevent the surface from falling off.

SMTThe surface mount technology (SMT) adhesive cures when heated. The general curing temperature for SMT processing is150No matter how much it is heated, it will not melt. That is to say, the thermal hardening process of surface mount technology (SMT) processing is irreversible. The effect of surface mount technology (SMT) processing may vary due to differences in heat curing conditions, the objects to be connected, the equipment used, and the operating environment. When in use, it should be assembled according to the printed circuit board(PCBA,PCA)Select the surface mount adhesive based on the process.

SMTThe application effect of surface mount adhesive may vary due to differences in heat curing conditions, the objects to be bonded, the equipment used, and the operating environment. When in use, the surface mount adhesive should be selected according to the production process.

①Prevent component detachment in wave soldering(Wave soldering process);

②Prevent the components on the other side from falling off during reflow soldering(Double-sided reflow soldering process);

③Prevent the displacement and positioning of components(Reflow welding process, pre-coating process );

④Make a mark(Wave soldering, reflow soldering, pre-coating);

① When using wave soldering, to prevent components from falling off as the printed circuit board passes through the solder bath, components are fixed on the printed circuit board.

② In the double-sided reflow soldering process, to prevent large components on the already soldered side from falling off due to the melting of solder caused by heat, it is necessary to haveSMTSurface mount adhesive.

③ It is used in reflow soldering processes and pre-coating processes to prevent displacement and vertical placement during mounting.

④ In addition, when printed circuit boards and components are changed in batches, they are marked with surface mount adhesive.

Shenzhen CityJJY The brand's solder paste has gone through many years12A solder paste and wire manufacturer specializing in the annual research and development of solder paste, solder wire, solder wire, lead-free solder paste, leaded solder paste, solder rods, leaded solder paste, etc. Choose the solder paste manufacturer of JJY brand for solder paste.