How to solve the problem of component dropping during double-sided SMT patch solder paste soldering?

In our useSolder pasteWhen soldering double-sided patches, the problem of component dropping may occur. What causes this? And how should it be solved? The following is JJYSMTLet's have the surface mount solder paste manufacturer explain:

This phenomenon is due to the insufficient vertical fixing force of the solder on the component after the solder paste melts. The main reasons are:

1The solderability of the pins of the components is poor;

2The wettability and solderability of solder paste are poor;

3The furnace temperature during welding was not well controlled.

4The electronic components are too heavy;

For these four problems, we suggest adopting the following methods to solve them:

1If the solderability of electronic components is poor, we must inspect the electronic components before soldering and remove those that have been oxidized.

2If the solder paste has poor wettability and solderability, let's try this type of solder paste first. If it doesn't meet the standards, discard it.

3The furnace temperature was not well controlled. This is because we are using double-sided surface mount technology, and both sides need to be soldered. Therefore, the melting point of the solder paste used for soldering the second side must be lower than that of the solder paste for the first side. In this way, there will be no more component drops.

4If the above three aspects are all well controlled but the problem of parts falling off still occurs, it means that the parts are too heavy. At this point, we should first fix it with red glue and then solder it with solder paste.

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