How to improve the solder dropping property and solder crawling property during lead-free solder paste printing?

In useLead-free solder pasteDuring the process, you may encounter problems such as missed welds and incomplete welds. This is because the solder paste has poor solder penetration and solder creep during soldering. How to improve the solder paste's desoldering property and solder climbing property during soldering? Today, JJY solder Paste Manufacturer will talk about it:

1Subtract the foot diameter from the aperture after the experiment0.3mm-0.5mmMore appropriate;

2During the printing process, it must be kept clean and free of any residue.

3The temperature for solder paste printing should be stable, and the temperature difference between high and low should not exceed the limit5Degree;

4The air intake from the tin furnace should not be too large, and the bottom of the tin furnace should be sealed.

5,PCBTGBe tall140℃-150℃;

6Above the holepadIt should be small, belowpadBe big, not have itpadAll grounded;

7,PCBThe tin-absorbing property (wettability) of the components and flux should be good, and there should be no oxidation.

8The welding time is required3.5More than a second, and the peak value should be high enough;

9Blow!coldairDon't rely too much on the tin furnace.

The above is the knowledge compiled by the editor about improving the solder climbing property during lead-free solder paste printing and soldering. I hope it will be helpful to everyone! If you want to learn more about solder paste, please keep following JJY Solder Paste Manufacturer and leave a message online to interact with us.