In surface mount technology (SMT) processing,Solder pastePrinting quality is of great significance and will directly affect the subsequent processSMTThe quality of processing has a series of impacts on the entire processing of electronic products. The quality of solder paste printing in surface mount technology (SMT) processing is influenced by many factors. The thickness of the template and the opening size have the greatest impact on the amount of solder paste printed. If the template is too thick, the opening size is too large, or there is too much solder paste, bridging may occur. On the contrary, a small amount of solder paste will lead to insufficient solder. The shape of the template opening and whether the opening is smooth will also have an impactSMTThe quality of solder paste printing and demolding in surface mount processing. Now, let's have the solder paste manufacturer explain:
Regarding the quality of solder paste printing,Judgments should be made from the following points:
1The content of printed solder paste is uniform and has good consistency.
2The solder paste pattern is clear and there is no adhesion between adjacent patterns.
3The solder paste pattern and the solder pad pattern should be as accurate as possible.
4The amount of solder paste per unit area on the pad for surface mount processing isQ.8mg/mm2On the left and right, the fine-pitch components are0.5mg/mm2Left and right;
5The area of the solder paste covering the solder pad should be75%Above;
6After the solder paste is printed, there should be no severe sagging and the edges should be neat,The dislocation should not be greater than0.2mm; Thin-pitch component pads,The dislocation should not be greater than0.1mm.
7,PCBAThe substrate must not be contaminated by solder paste.
The above is a relevant introduction to the quality of solder paste printing. If you need to know more about our products, welcome to follow JJY Solder Paste Factory and leave an online message to interact with us.