inSMTIn the production industry, solder paste is a kind of soldering material. It is a paste solder formed by uniformly mixing alloy powder and paste flux carrier. There are many.PCBDuring the production process, manufacturers all report that solder paste dries out particularly easily. Next, the solder paste manufacturer will introduce to you the reasons why solder paste dries out particularly easily and the solutions.
The prerequisite is that during the reflow soldering process of solder paste, when it is used in a small area, it is definitely more likely to harden than the solder paste in the solder paste box. At this time, it will cause the solder paste to not dissolve, and the flux cannot cover the soldering point, resulting in poor processing of the soldering point. In this way, a small amount of solder paste is easier to heat up. High temperature actually makes the solder paste not easy to dissolve. Then we can try to adjust the reflow soldering temperature curve to improve it, or perform soldering processing in a nitrogen environment. Most of these are methods to alleviate such problems.
Moreover, the reason why solder paste does not dissolve is that it contains particularly volatile flux in its composition, which is the fundamental cause of solder paste being particularly prone to hardening. Among them, the flux with the most extensive solder paste content is rosin. Rosin contains various rosin acids, which are particularly prone to losing their activity at excessively high temperatures. To this end, it is necessary to regulate the surface temperature of the welding process and maintain the working temperature200℃The appearance should be either too high or too low. In this way, the quality of the thixotropic agent can also cause the solder paste to dry out particularly easily. If the quality of the thixotropic agent is poor, it will affect the viscosity of the solder paste. If the viscosity is too high, the solder paste may dry out. Therefore, determining high-quality solder paste can also completely solve the problem that solder paste is particularly prone to hardening.
Besides,Solder pasteExternal factors such as the application scenarios, humidity, and working temperature can also affect the hardening and insolubility of solder paste during use. Therefore, we should pay attention to these external factors and hope that these methods can solve everyone's problems.