What are the performance characteristics of lead-free and no-clean solder paste? Let's briefly discuss.

Lead no-clean solder paste is a new type of solder paste. This solder paste is a lead-free, no-cleaning, low-halogen solder paste and low-halogen solder paste. The design of the specific reflow furnace temperature curve process window ensures that the related lead-free brazing problems remain colorless. Applicable to the temperature curve of high-temperature solder paste; Meet the requirements of medium-speed printing for hand printing and machine printing. The excellent reflow process window makes it very good for soldering plates,It has a good combination with printing dots of various sizes, and also has excellent anti-irregular tin beads and anti-sputtering tin beads performance. The appearance of the solder joints is matte treated, with no residual color, and the solder joints are easy to visually inspect. It is suitable for various brazing application scenarios and is mainly used in high-speed printing and mounting production lines. The solder paste manufacturer will introduce the following features to you:

Lead-free and no-cleaning solder pastePerformance characteristics:

1AdoptSAC305The melting point of lead-free no-wash solder paste with the main alloy is slightly higher than that of traditional solder paste.

2At room temperature, its physical and chemical properties are relatively stable and it is not easy to crystallize.

3It has a wide range of selectable process parameters, enabling it to adapt to different environments, different equipment and different application processes.

4It has excellent anti-drying ability and can ensure that the solder paste has good adhesion for more than eight hours under continuous printing conditions.

5At the same time, it can ensure excellent continuous printing, anti-collapse ability and surface insulation resistance performance.

6The lower residue after welding can be guaranteedICTPassing the test

7Excellent reflow soldering yield rate,For every detail0.25mm(10mil)theBGAAll circular solder joints can achieve complete alloy fusion. The fine spacing is0.12-0.25mmIt is recommended for use at that time4#Powder If the spacing exceeds0.28mmThen it is recommended to use3#Powder.

8Excellent printing performance, capable of serving allPCBThe board design provides stable and consistent printing effects, and the printing speed can reach50-120millimeter/Seconds, short printing cycle and high output.

9The perfect reflux temperature curve process window can be provided for various typesPCBplate/The components provide good solderability.

10Compatible with nitrogen or air reflux.