What are the reasons for the appearance of solder holes in lead-free solder paste after passing through the furnace? A brief discussion.

inLead-free solder pasteDuring the printing process, there are occasional occurrences related to tin holesPCBBoard problem. What is the reason for this situation? Next, the solder paste manufacturer will lead everyone to discuss:

The related issues of solder holes in lead-free solder paste after passing through the furnace mostly include the following aspects:

1The soldering temperature is very low.

2The solder is too dirty, there are many other impurities, the surface layer of the substrate material is contaminated with dust, the printed surface of the screen comes into contact with dust, blocking the mesh holes, causing the mesh holes to be blocked and presenting blank holes.

3Uneven tin furnaces cause uneven thickness of solder paste.

4The preheating temperature is too high or particularly low;

5,FluxThe setting is incorrect;

6Deviation of the weldability of the sheet materialPCBThe production process of the coating for the through holes of the plate did not meet the special requirements of the coating.

7,FluxInsufficient activity

8If there is an excessive amount of tin slag, it should be immediately collected and cleaned.

9It is necessary to adopt improved welding processes, such as tin slag reducing powder.

10The surface layer of the substrate material has grease, which is incompatible with the solder paste. The solder paste shrinks, oozes oil, and forms micro-pores.

In response to these related issues, everyone is trying every possible way to make corresponding improvements, so as to solve the problem of solder holes after lead-free solder paste passes through the furnace.