What to do if solder paste causes solder joint voids? A brief discussion.

In useSolder pasteDuring the process, the phenomenon of welding voids may occur. How should this problem be solved in the face of it? Today, the solder paste manufacturer will talk to you about this aspect of knowledge.

Reasons for solder paste generating solder joint voids:

1The proportion of the intermediate flux is too high to completely volatilize before the solder joint cures.

2If the preheating temperature is too low, the solvent in the flux cannot fully evaporate and will remain at the solder joint, thereby causing filling defects.

3This usually occurs when the solder alloy in lead-free reflow soldering solidifies4％If the volume shrinks and the final solidification area is located inside the solder joint, voids are very likely to occur.

4Organic substances that are contaminated during the operation process can also cause voids.

5If the welding time is too short and the gas escape time is insufficient, it will also cause filling cavities.

Preventive measures for solder joint voids caused by solder paste:

1Adjust the process parameters, control the preheating temperature and welding conditions well;

2The proportion of flux should be appropriate.

3Avoid contamination during the operation process.

The above is some sharing about solder paste causing solder joint voids. Shenzhen JJY Solder Paste Manufacturer has established mutually beneficial cooperation with electronic product manufacturers, providing solder paste, flux paste, lead-free solder paste, solder wire, solder bar and other fine electronic solder products. It has a rich variety of successful cases in the research and development and application of fine electronic solder products, and has built a high-quality and honest sales market by relying on its overall strength.