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What are the functions and purposes of solder paste printing on pcb boards?

Return to List source: JJY Release Date: 2023.12.20

Surface mount technology (SMT) processing is a process calledsmtThe electronic manufacturing process. There is one or more in electronic productspcbaBoard, andpcbaNeedsmtSurface mount technology processing Before attaching the surface mount components, it was onepcbLight plate. Today, JJY solder Paste Manufacturer will have a chat with everyonepcbPlate printingSolder pasteThe functions and purposes:

Solder paste

pcbThe solder paste for plate printing mainly has two major functions

1. Fixed electronic components

Solder paste is something similar to toothpaste and has a bit of stickiness. Electronic components are placed on it through a surface mount machinepcbOn the solder pad, the components are slightly adhered by the viscosity of the solder paste without allowingpcbThe transfer platform fell off due to vibration during the conveying process.

2. Reflow soldering, hot melting of solder paste, and solder crawling at the bottom of electronic component pinspcbPad fixation

The most important thing for solder paste is to perform reflow soldering, allowing electronic components to absorb solder and thus reactpcbThe pad is fixed because the components of the solder paste are flux and tin powder. The tin powder is melted at high temperature in the reflow soldering to form liquid tin, which enables the pins of the components to absorb tin. After passing through the cooling zone of the reflow soldering, the liquid tin turns solid, thereby fixing the components to the pad and exerting their electrical and thermal conductivity, thus fulfilling the functions of various components.

Solder paste

JJY solder Paste Manufacturer mainly engages in lead-free solder paste.SMTSurface mount solder pasteLEDResearch, development, production and supply of solder pastes, lead-free solder wires, wave soldering rods and other solder solders. For more knowledge about electronic soldering, please contact us. Welcome to interact with us.

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Brand:JIAJINYUAN/JJY Model:LFP-JJY5RQ-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:190±20Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle
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Brand:JIAJINYUAN/JJY Model:LFP-JJY5RNTT-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:170±20)Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle

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