What are the requirements for solder paste in Led chips? Is there any difference in operation?

Nowadays,Solder pasteMainly usedLEDWelding and packaging in the electronics industry.LEDA chip isLEDThe key to the electronics industry. What are the requirements for solder paste? Is there any difference in operation? Below, the solder paste manufacturer will explain it to everyone:

LedChips are generally used in fine-pitch or high-power types, so the solder paste powder frequently used should have smaller particles, lower viscosity, higher activity, and better thixotropy, which can better provide the required thermal conductivity for smaller devices. At the same time, it is required to have very good solderability and ease of operation, etc.

ledSolder paste is generally used for soldering between metals and is also very good in the process of normal use with good electrical conductivity. As shown by the relevant data and the specific results of the experiments,LEDThe thermal resistance of the device is approximately greater than that of solder paste as the bonding material10K\W. In the normal usage process, high-temperature solder paste can be used as a combined material, and this should be of the power typeLEDIt is a good first choice.

inLEDIn industries such as wafer mounting, solder paste can rely on the currently available conductive silver adhesives and thermal adhesives as well as some mounting materials. In this way, more effective thermal conductivity can be achieved, and the mounting cost can also be significantly reduced.

LedKey points for using solder paste:

First of all,ledThe surface treatment process of components, generally speakingledThe components are basically all usedledBefore the antennae are used normally, surface cleaning work should be carried out on the components to remove rust, dust, etc. on the welding surface. This not only affects the quality of the welding but also givesledThe welding caused irreparable damage. These impurities can be scraped off by hand wiping or scrubbed off with alcohol.

The other one is trial debugging. The main factor for adopting trial debugging remains the hope of being helpfulledTo achieve more effective product positioning for components and increase the precision of soldering, it is necessary to evenly spread the solder paste in this caseledOn the electronic board, the quality and process specifications of the soldering are increased in this way, and it is adoptedledThe component has a very good soldering effect.

The last one is through a certain amount of solder paste,Too little solder paste is also not good,Because it cannot provide the necessary protectionledComponent,Too much solder paste is not very good either,Excessive solder paste will take away a large amount of heat,This leads to a slow speed of the welding machine,The welding efficiency is very low.