With the rapid development of component packaging technology, more and morePBGA,CBGA,CCGA,QFN,0201,01005Resistors and capacitors have been widely applied, and surface mount technology has also developed rapidly. During the production process, for the entire production processSolder pastePrinting is also receiving increasing attention from technical engineers. In the field, companies generally recognize that to achieve better soldering and long-term reliable quality of products, the printing of solder paste should be given high priority. Now, let's have Shenzhen JJY Solder Paste Manufacturer introduce in detail to you what key points should be noted during the solder paste production process?
1The solder paste must be within its validity period when in use. Usually, solder paste can be stored in the refrigerator. Before use, it should be placed in an outdoor natural environment6The lid can be opened for use only after an hour(If there is a small mist on the packaging, wipe it clean with a cloth. Avoid the injection of such small water mist into the packaging). The solder paste after application should be stored independently. When using the independently stored solder paste again, it is necessary to confirm whether the quality meets the standards.
2Before application, the staff should stir the solder paste with common tools to make the composition of the solder paste more and more uniform. During the production process, the viscosity of the solder paste should be tested with a viscosity tester.
3Within working days, after printing the first printed board or adjusting the machine equipment, use a solder paste thickness detector to test the solder paste. The parts to be inspected are on the left and right, top and bottom, and exactly in the middle of the surface of the printed circuit board5Point and record the detected values. It is stipulated that the thickness of the solder paste produced and manufactured should be within the thickness of the template-10%and+15%Between.
4During the production and manufacturing process, the quality of solder paste printing should be inspected. The inspection contents include: whether the solder paste pattern is detailed, whether the thickness is uniform, and whether there is any sharpening of the solder paste.
5After the work is carried out, clean the printed circuit board in accordance with the regulations of the processing technology.
6After the printing test or unsuccessful printing, the solder paste on the printed circuit board should be cleaned with an ultrasonic cleaning device and then dried to prevent solder balls from forming after the reflow oven due to residual solder paste on the board when it is used again.
As a 16-year-old veteran solder paste manufacturer, JJY has been dedicated to the research and development and production of solder paste for many years. The quality of the solder paste is stable, without solder bonding, false soldering or establishing a reputation. No residue, Wuxi beads, bright and full solder joints; The weld points are firm and have excellent electrical conductivity.