During the process of screening solder paste, what requirements and norms should be followed for the screening?

During the process of screening solder paste, what requirements and norms should be followed for the screening? At present, for a manufacturer or small and medium-sized enterprise engaged in the production and processing of solder paste, the key difficulty lies in maintaining the quality of the product itself, which is determined by the solder paste There are many elements of printing quality, such as the production and manufacturing process of steel wire mesh, and the perforation design scheme of steel wire mesh.PCBThe flatness, the setting of the main printing parameters, and the characteristics of the solder paste itself, etc. For elements such as the output rate steps of solder paste,JJY FactoryThe editor will give you a detailed introduction:

1When choosing solder paste, the characteristics of the solder paste should be selected based on specific conditions such as the assembly process of the product, printed circuit boards, and electronic components. In this way, qualified process products can be produced.

2When choosing solder paste, people select the particle size of the solder paste based on the assembly density of the printed circuit board. The commonly used solder paste particle sizes are generally divided into four grades, and the smaller ones are usually chosen20-45um.

3When choosing solder paste, you can select solder paste products based on the storage time of printed circuit boards and electronic components and the oxidation level of the solder paste. The solder paste is separatek,j,r,m,aFive levels. Products with high characteristics are generally chosenrGrade. The storage time of printed circuit boards also has a relatively severe surface oxidation, and people usually choose itr,aAfter soldering it with solder paste, rinse it.

4When choosing solder paste, everyone should select it based on the cleanliness requirements of the printed circuit board and the different levels of cleanliness after soldering.

In order to better produce products that meet the processing standards, during the screening of solder paste, it is necessary to follow the production process flow of the product.pcbWhen conducting a screening based on some specific principles such as circuit boards and electronic components, partners will often come across solder paste particles4A different model specification.

In most cases, partners will screen for a fine distance ranging from twenty to forty-fiveμmFor the scope, the particle size of the solder paste can be further selected by referring to the installation relative density of the printed circuit board, or by referring to the length of time the printed circuit board is placed after packaging as a basis.

Because the solder paste will be oxidized in the air, the partners will definitely choose to solder the solder paste tightly first and then clean it further.

When screening out the solder paste that suits the needs of the partners themselves, it is necessary to rely onpcbThe circuit board is distinguished by a different cleanliness level after soldering, and a solder paste screening is carried out. It is inevitable that there are some problems in the field of no-cleaning processing technology.

Want to know about solder pasteLead-free solder pasteFor any soldering issues such as solder paste, we welcome partners to consult Shenzhen JJY Industrial Technology Co., LTD. Let's learn and grow together! The solder wire, solder paste and solder rods of JJY brand are always waiting for partners to come and take them together.