JJY | What are the ingredients of SMT solder paste

Solder pasteAsSMTIn the production process, the particle size of tin powder in solder paste, the proportion of metal content, the content of flux, the stirring time, the temperature recovery time, as well as the placement and storage time of solder paste will all affect the final printing quality of the solder paste. Now, JJY solder Paste Manufacturer will explain it to you:

SMTThe components of specialized solder paste are usually divided into two categories, namely solder powder alloy and flux.

The combination and function of alloy powder materials:

Solder powder alloy is the core component of solder paste, accounting for at least of the total mass of solder paste85%~90%. The more common alloy combinations include the following types: tin-lead alloySn-PbTin-lead-silver alloySn-Pb-AgTin-copper alloySn-CuTin-silver-copper alloySn-Ag-CuTin-bismuth alloySn-BiTin-bismuth-silver alloySn-Bi-AgEtc.

The effective components, proportion, particle size and oxidation degree of alloy powder materials have a direct impact compared with solder paste.

When the alloy content is relatively high, it can alleviate the slump of solder paste, which is conducive to promoting the formation of full and bright solder joints. Moreover, as the content of flux changes along with the continuous increase of alloy content, the residual matter after soldering is also reduced, effectively preventing the existence of solder beads. However, the drawback is that the relevant requirements for printing and soldering processes are becoming increasingly strict.

When the alloy content is relatively low, the printing performance will be good, the solder paste is less likely to stick to the squeegee, the wettability is good, the printed circuit board is durable, and the manufacturing and processing will be relatively easy. However, the disadvantage is that it is prone to collapse, and defects such as solder beads or bridging are likely to occur.

The combination and function of flux:

Active agent: The main function of this active ingredient is to removePCBOxides play an important role on the surfaces of circuit boards, copper film pads and the soldering parts of electronic devices, and they can also reduce the liquid surface tension of metals such as tin and lead.

Organic solvents: This active ingredient is mainly concentrated during the stirring process of solder paste, playing a role in regulating the uniformity and having a significant impact on the service life of the solder paste.

Thixotropic agent: This substance is mainly used to adjust the viscosity and printing performance of solder paste, which can prevent problems such as tailing and adhesion that often occur during the printing process.

Rosin:Rosin can enhance the adhesion of solder paste, protecting the system and preventing solder after solderingPCBIt plays an important role in the re-oxidation of circuit boards. It will also play a crucial role in the fixation of electronic devices.

Shenzhen JJY Industrial Technology Co., Ltd. mainly engages in the production and operation of:SMTSolder paste manufacturers of solder paste, syringe solder paste, lead-free solder wire, wave soldering bar, automatic soldering wire, etc.