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What are the performance characteristics of lead-free solder paste for tube printing of JJY?

Return to List source: JJY Release Date: 2024.07.29

Lead-free solder paste for tube printing (also known as lead-free solder paste for high-frequency heads) is a solder paste specially designed for the tube printing process. The tubular printing process is mainly used for the welding of through-hole components. For solder joints with smaller spacing, it can achieve an effect that wave soldering cannot match. Due to the different printing processes, lead-free solder paste for tube printing is different from that of ordinary onesSMTThe performance characteristics of lead-free solder paste also vary. Here is a brief introduction from JJY Solder Paste Manufacturer:

Lead-free solder paste

Appropriate viscosity and fluidity. Because the solder paste needs to be printed onto the board surface through tiny tube holes, compared with the ordinary onesSMTSolder paste. Lead-free solder paste for high-frequency heads needs to have better fluidity to ensure that an adequate amount of solder paste passes through the tube holes.

Different tube hole diameters and lengths will have slightly different requirements for the viscosity of solder paste. Solder paste with moderate viscosity and good fluidity can meet the requirements of more types of tubular molds, while solder paste with too high or too low viscosity may cause significant printing differences due to different molds.

It has good resistance to cold and heat collapse. Due to its relatively ordinary viscositySMTThe solder paste is low, and lead-free solder paste for high-frequency heads is relatively more prone to collapse. However, lead-free solder paste has a higher surface tension during melting than traditional ones63/37The solder paste is large, so if it collapses and connects with other pads before melting, the probability of forming a bridge after reflow is greater.

Bridging is one of the most common problems in the production of high-frequency heads. With the development of digital high-frequency heads, high-density designs have become increasingly common. Therefore, good cold and heat collapse resistance is particularly important. Choosing the appropriate solder paste is an important way to avoid bridging, reduce rework volume, and improve production efficiency and product reliability.

The viscosity change is small and the service life is long. Viscosity changes can cause variations in the print volume, which is particularly evident in tubular printing. Therefore, maintaining a relatively stable viscosity is very important for ensuring the consistency of solder joints. In most cases, when the viscosity of solder paste increases, it is accompanied by a decrease in viscosity. For instance, when solder paste dries, it will almost lose its stickiness. As a result, during the insertion process, the solder paste will be pushed off due to the loss of stickiness, causing missed soldering.

It has good solderability and strong tin coating capacity. Many high-frequency head manufacturers adopt it2Once, even3The production process of secondary reflux1timeSMTPatch reflow, the first2,3(Secondary plug-in or case reflux). Because of having experienced1timeSMTPatch reflowPCBThe through hole part (plug-in position) on it has been oxidized, so in the first2,3During the secondary reflow, it is required that the solder paste has relatively stronger solderability and soldering ability to ensure the soldering quality and reduce the probability of false soldering and false soldering.

16For many years, JJY Solder Paste Factory has been dedicated to the research and development, production and sales of solder paste, providing customers with a complete set of electronic soldering solutions. If you want to learn more about solder paste, please keep following JJY Solder Paste Manufacturer and leave a message online to interact with us.

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