What are the characteristics of solder paste containing the metal element "bismuth"?

Bismuth is a metallic element with relatively stable chemical properties, and its elemental symbol isBiAtomic number is83The element is a metal ranging from silvery white to pink. Containing bismuthSolder pasteAlso known as tin-bismuth solder paste, the more common types areSn42Bi58The alloy ratio is tin.Sn)42%BismuthBi)58%. Next up is Shenzhen JJYSolder paste manufacturerHere are several advantages of adding "bismuth" to solder paste:

1Lower the melting point of the solder paste. The melting point of tin itself is relatively high, but after adding bismuth to form an alloy, it can effectively lower the melting point of the solder paste.

2To enhance the hardness of the solder paste, although pure bismuth is very soft, when it contains impure elements, bismuth becomes somewhat hard and brittle. Moreover, it is relatively stable at room temperature and can increase the hardness of the solder paste to a certain extent.

The melting point of this solder paste is only138℃This is what we often call low-temperature solder paste, when the components on the surface mount cannot withstand it200℃This kind of solder paste is used when the above high temperature is applied and the surface mount reflow soldering process is required.

Characteristics of low-temperature solder paste:

1"Conform to"RoHSStandard

2Low melting point, only139℃;

3It has good wettability, and the solder joints are bright, uniform and full.

4When re-soldering, Wuxi beads are produced, and bridging phenomena are less likely to occur.

5It has excellent printability and is less likely to have omissions, depressions or lumps during the printing process.

6Suitable for a wide range of manufacturing processes and rapid printing;

7Long bonding life, long steel mesh printing life;

Therefore, low-temperature solder paste isLEDIt is very popular in welding. In addition, tin-bismuth solder paste is also widely used in the welding of heat sink modules, high-frequency welding, various lighting fixtures, computer motherboards, mobile phone motherboards and other welding scenarios.

Although adding the "bismuth" element to solder paste can bring many advantages, there are also disadvantages. If the bismuth content is too high, it will cause the solder paste to become brittle. In addition, the conductivity of the "bismuth" element itself is only good, not excellent, which leads to the average conductivity of the solder paste. Therefore, Shenzhen JJY solder Paste Factory has developed tin-bismuth silver solder paste to solve the problem of average conductivity.

In conclusion, adding the "bismuth" element to solder paste can effectively lower the melting point of the solder paste and the temperature requirements of the working environment, enabling some components or circuit boards that cannot withstand excessively high temperatures to be safely soldered.

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