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What are the basic contents of process research on solder paste in the smt industry?

Return to List source: JJY Release Date: 2021.11.17

At present, one of the most popular technologies in the electronic assembly industry, with the continuous increase in circuit assembly density, the wide application of reflow soldering technology, and the proposal of the concept of "green assembly", SMTThe demand for solder paste in industry is constantly increasing. Nowadays, it has become one of the indispensable raw materials. But have you ever known about the issues that should be noted during the usage process? Currently,Solder pasteThe research and development work is still ongoing, with the main research directions being the following two aspects.

Solder paste

1It is suitable for the development of equipment and assembly technology.

FPTIt is widely used in multi-lead and fine-pitch applicationsSMICIn the equipment. The assembly, assembly process and welding performance requirements of these devices are very high.

2And the new type Device And assembly Technology The development Compatible

BGAChipCSPThe assembly of new equipment such as chips, the assembly of bare chips, the mixed assembly of bare chips and equipment, high-density assembly, three-dimensional assembly and other new assembly forms have different requirements for solder paste, and the corresponding research work has never stopped.

3Environmental protection requirements

Chang CAI There are two post-weld no-wash processes used. One is Use solid content Low post-weld no-clean flux, such as Use polymers And synthetic resin flux This flux can be directly used in the wave soldering process or formulated for the reflow soldering process. Another one is welding in an inert gas or in a reactive atmosphere.▩Such as nitrogen-protected double-wave soldering Both the equipment and the infrared reflow soldering equipment Has been put into use.

At present, lead-free solders that replace lead-containing solders have been developed both at home and abroadSolder pasteThe research and development work to replace the research and development of lead solder. These specific special issues still require breakthroughs in technical research. Welcome to consult Shenzhen JJY Industrial Technology Co., LTD. Let's learn and grow together!

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LFP-JJY5RQ-305T4 halogen-free and lead-free high-temperature solder paste

Brand:JIAJINYUAN/JJY Model:LFP-JJY5RQ-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:190±20Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle
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LFP-JJY5RNTT-305T4 halogen-free and lead-free high-temperature solder paste

Brand:JIAJINYUAN/JJY Model:LFP-JJY5RNTT-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:170±20)Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle

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