What are the reasons for the tin explosion phenomenon during soldering?

Tin frying isPCBAA kind of poor welding phenomenon in the processing procedure, that is, the weld points during processingSolder pasteIf cracking occurs, leading to incomplete solder joints, pores, solder beads and other phenomena, then what exactly causes the occurrence of solder cracking? Next, Shenzhen JJY Solder Paste Factory will take you to have a detailed understanding

The reason for the occurrence of tin frying is usually due toPCBCaused by moisture and in a high-temperature state during the welding processPCBTin explosion often occurs after coming into contact with solder. To solve this problem,SMTA surface mount technology (SMT) processing factory can be located atPCBDuring the storage process, vacuum packaging is used, or baking is carried out before starting production and processing.PCBThe time for baking components on the board needs to be set according to the actual situation.

Apart from moisture, the incorrect use of flux is also one of the reasons for the occurrence of solder soldering. This includes excessive use of flux, moisture absorption of flux, and abnormal component ratios, all of which can lead to itSMTPoor processing occurred in the surface mount technology (SMT) processing. To avoid these poor processing phenomena caused by improper use of flux, some points also need to be noted, such as sealed storage of solder paste, selection of solder paste with appropriate flux, and strict control of flux composition, etc.

As a 16-year-old veteran solder paste manufacturer, JJY has always been committed to the research and development, production and sales of solder paste. The quality of the solder paste is stable, without solder bonding, false soldering or establishing a reputation. No residue, Wuxi beads, bright, full, firm solder joints with excellent electrical conductivity. If you have any needs, please feel free to contact us.