DifferentLead-free solder pasteWhat should be noted when choosing the temperature? For friends who have used lead-free solder, it is known that lead-free solder paste has different temperatures, including low-temperature and high-temperature distinctions. As the name suggests, lead-free high-temperature solder paste is used in high-temperature environments, and the same applies to low-temperature ones. Therefore, when choosing solder paste, one should not be too blind and should select the melting point based on their own actual situation.
Solder paste isSMTIn the basic soldering materials of the surface mount technology (SMT) production and processing industry, medium-temperature solder paste, high-temperature solder paste and ultra-low-temperature solder paste are commonly used in heavy metal-free solder paste.
1Ultra-low temperature solder paste, to put it simply, has a relatively low melting point. Its main components are tin and bismuth. After adding bismuth powder to the solder paste, the temperature will lower its melting point138℃. It is applicable to these components that cannot withstand high temperaturesPCBThe weldability of ultra-low temperature solder paste electric soldering is relatively weak, spot soldering is brittle, and the gloss is dull.
2High-temperature solder paste has a relatively high temperature requirement when passing through the furnace, and its melting point should be higher thanSN/BISolder paste, higher than79℃Above, the main components are composed of tin, silver and copper, with a melting point of217℃-227℃Above. It is widely used in electric welding, featuring good weldability, firmness and sturdiness, good impact toughness, and bright spot welding. An ultra-low temperature heavy metal-free solder paste, in which the tin content is42%The increase in bismuth powder has exceeded58%The melting point of this solder paste is138℃It is suitable for reflow ovens that require a relatively high levelReflow-soldering Follow the processing technology. This solder paste can be used with some household appliance components at low temperatures. It has excellent moisture resistance and soldering properties, making it particularly suitableLEDpcbElectric welding of circuit boards.
3.Medium-temperature tin-bismuth silver solder paste, in which the tin content is64%The bismuth content is35%The silver content is1%Melting point180℃; Working temperature required200~220℃(Time120~180Sec); Widely used inCPUHeat pipe radiator and heat dissipation control module.
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