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Some differences between wave soldering and reflow soldering - JJY Solder Paste Manufacturer
Return to List source: Release Date: 2021.03.15

    Friends should be no stranger to wave soldering and reflow soldering. There are differences between the two. So, in what aspects do the differences between them mainly lie? Just Shenzhen JJYSolder paste manufacturerCome and answer your friends' questions!

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    Wave soldering can be regarded as soldering larger and smaller components. The difference from reflow soldering is that reflow soldering pairspcbWhen the board and components are heating up; In fact, it was raised to the original levelSolder pasteMelting is to achieve the purpose of connecting the components withpcbThe boards are connected.

    Reflow soldering goes through three major modules: heating, reflow, and cooling. However, wave soldering is mainly applied to hand sockets and dispensing boards. It should be noted that all components used must be heat-resistant, and there should be no outdated components on the surface passing through the waveSMTComponents of solder pasteSMTFlux pastepcbThe board can be reflow welded, but wave soldering cannot be used anymore.

    Wave soldering is a process in which a tin bar is melted and transformed into a liquid state based on a tin bath. Use an electric motor to stir and generate wavespcbWeld with the parts. In most cases, hand-inserted welding is adoptedsmtStrong rubber sheet. The key point of reflow soldering isSMTThe field is printed through warm air or other forms of heat transferpcbThe solder paste of the plate melts and the parts are welded simultaneously.

    Want to know about wave soldering rodsSolder pasteFor answers to questions about other products such as tin wire, partners are welcome to consult. Let's learn and grow together at Shenzhen JJY Industrial Technology Co., LTD.!

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Brand:JIAJINYUAN/JJY Model:LFP-JJY5RQ-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:190±20Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle
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LFP-JJY5RNTT-305T4 halogen-free and lead-free high-temperature solder paste

Brand:JIAJINYUAN/JJY Model:LFP-JJY5RNTT-305T4 Alloy composition:Sn96.5Ag3.0Cu0.5 Particle size:4#(20-38um) Viscosity:170±20)Pa.S Activity: High activity Melting point:217℃ Peak temperature:230-260(℃) Specification:500g/bottle

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