LFP-JJY5RW1A-4258 is a water-washable lead-free low-temperature solder paste adapted to the Sn42Bi58 low-silver low-temperature alloy system, paired with the ORH1 water-washable flux. It provides smooth printing and filling with stable long-run production consistency, combining excellent low-temperature wetting with low-cost production, and is especially suited to soldering nickel-plated aluminum heat-sink fins, leaving no trace after soldering.

It provides stable activation on components with common PCB finishes such as bare copper, OSP and immersion gold. The mild-activity formula gently removes slight oxide on pads and suits low-temperature soldering. For fine-pitch ICs, small resistors/capacitors and nickel-plated aluminum heat-sink fins, it delivers full and even solder climb, effectively avoiding batch issues such as cold joints, insufficient solder and poor wetting, ensuring stable production yield.

Unlike conventional no-clean low-temperature pastes, the residue can be cleaned directly with pure water, without organic solvent cleaners, substantially cutting cleaning costs and lowering production expenses. After washing, the board is clean with no white haze or residue; the mild washing step does not corrode precision PCB circuits or molded component housings, meeting high-cleanliness production requirements.

Adapted to low-temperature operation, it supports T2.5, T3 and T4 powder sizes and suits single- and double-layer multi-pass reflow conventional SMT processes. All raw materials and finished products pass SGS testing and fully meet the RoHS directive, lead-free compliant for low-temperature high-volume production of consumer electronics, industrial power supplies, appliance motherboards and precision heat-dissipation modules.