Brand:JIAJINYUAN/JJYModel:LFP-0M-10Alloycomposition:Sn64Bi35Ag1.0Particlesize:20~38(um)Viscosity:200(Pa·S)Activity:WeakactivityMeltingpoint:217℃Workingtemperature:235-250(℃)Specification:500g/bottle
Brand:JIAJINYUAN/JJYModel:LFP-H-10Alloycomposition:Sn64Bi35Ag1.0Particlesize:250=-38(um)Viscosity:200(Pa·SActivity:WeakactivityMeltingpoint:217℃Workingtemperature:235-250(℃)Specification:500g/bottle
Inthiseraofrapidtechnologicaladvancement,LEDLedbeads,withtheircharacteristicsofhighefficiency,energyconservationandlonglifespan,arewidelyusedinvariousfieldssuchaslightinganddisplay.However,inLEDIntheproductionprocessoflampbeads,weldingisoneofthekeylinks,andtheselectionofmaterialsdirectlyaffectsthequalityandperformanceoftheproduct.Today,JJYsolderPasteManufacturerwillhaveanin-depthdiscussiononsolderingLEDWhenitcomestolampbeads,isitmoreappropriatetochooselow-temperaturesolderpasteormedium-temperaturesolderpaste?Low-temperaturesolderpaste:Delicatecare,exquisite......
WhileweareconductingSMTInthisprocess,leadedsolderpasteorlead-freehigh-temperaturesolderpaste,lead-freemedium-temperaturesolderpaste,andlead-freelow-temperaturesolderpasteareusuallyused.Forcardboardboards,weusemedium-temperaturesolderpaste,andforLEDAluminumsubstrateplate,highpowerLEDThenlow-temperaturesolderpasteisrequired,andT5T8Fluorescentlampsrequiremorehigh-temperaturesolderpasteandlessmedium-temperaturesolderpaste.ForLEDSoftboardsheetMPCForboards,high-temperaturesolderpasteisgenerallyonlyusedinsteadofmediumandlow-temperaturesolderpastebecauseitiseasiertousemediumandlow-temperaturesolderpaste......
SMTOneoftheindispensablesolderrawmaterialsintheproductionprocessissolderpaste.Thegeneralsolderalloycompositionofmedium-temperaturesolderpasteis:S64.7Bi35Ag0.3,S64Bi35Ag1,S59.9Bi4Cu0.1,S69.5Bi30CU0.5,S82.5Bi17Cu0.5Therearefivespecifications.Thesolderalloypartaccountsforthetotalweightoflead-freemedium-temperaturesolderpaste90%-95%Betweenthetwo,solderalloypowderiscomposedofseveralalloymaterialssuchastin,silver,tinandcopper,andtheimpurityresiduestandardcontentofthealloypowderisrequiredtobe......
Thecompositionoflead-freemedium-temperaturesolderpasteconsistsoftwoparts:solderalloypowderandfluxpaste.Thegeneralcompositionofthesolderalloyis:S64.7Bi35Ag0.3,S64Bi35Ag1,S59.9Bi4Cu0.1,S69.5Bi30CU0.5,S82.5Bi17Cu0.5Therearefivespecifications.Thesolderalloypartaccountsforthetotalweightoflead-freemedium-temperaturesolderpaste90%-95%Betweenthetwo,solderalloypowderiscomposedofseveralalloymaterialssuchastin,silver,tinandcopper,andtheimpurityresiduestandardofthealloypowderisrequiredtocontain......
Webelievethatsolderpasteisasolderingmaterial.Intheproductionprocessofelectronicproducts,techniciansplaytheroleoffirstprintingsolderpasteonPCBOnthesubstrate,componentsareinstalledwithaninstallerandfirmlyweldedthroughaweldingfurnace.Ifthesolderpasteisnotuseduponthesamedayandisnottobeproducedthenextday,putitbackintherefrigeratorforstorageandmarkthetimeonthelabel.IntroductiontoLeadedSolderPaste:Leadedsolderpasteiscomposedofamixtureofsolderingfluxcomponentsandalloycomponents.Amongthealloycomponentsitoccupies,tinand......
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