WithsmtThe demand for proofing is getting higher and higher, and the efficiency of surface mount technology (SMT) proofing is particularly important. However, insmtIn the surface mount technology (SMT) process, the phenomenon of "monument erection" often occurs. There are many reasons for this, but not all of them will definitely lead to monument erection. The main reason for the monument erection phenomenon is the imbalance of the wetting force at both ends of the component, which causes the torque at both ends of the component to also be unbalanced, resulting in monument erection. JJYSolder paste manufacturerToday we are going to explain:

1During the printing process, the printing was not uniform, resulting in the solder paste being thinner on one side and thicker on the other. After heating, the tensile strength on both sides was different, causing one side to miss the solder and the other side to lift up and stand as a monument.

2Oxidation of electronic components, poor solder paste effect, uneven heating at both ends, resulting in the appearance of the monument.

3,SMTThe patch is offset, resulting in uneven heating.

4During reflow soldering, the furnace temperature was not set properly, with one side having a low temperature and the other side having a high temperature.

5The solder paste dried up after being left for too long, and its activity declined, resulting in the appearance of a monument.

The above issmtThe reasons for the "monument erection" in surface mount technology (SMT) prototyping can be quickly resolved through corresponding adjustments. Shenzhen JJY Industrial Technology Co., Ltd. is one such company15We have been engaged in the research and development, customization and production of solder paste, solder wire, lead-free solder paste and leaded solder paste for many years. If you want to learn more about soldering, please continue to follow JJY Solder Paste Factory and leave a message online to interact with us.