Soldering Technology, Tin Leads The FutureOne Stop Electronic Tin Soldering Solution Supplier

Industry News
What is the function of lead-containing solder paste? In which fields is it applicable?
source: JJY Release Date: 2022-01-22

With the emergence of many industries, everyone knows that solder paste is a must for soldering materials. Nowadays, there are more and more types of solder paste, which leads people to lose themselves in this situation and not know which type to choose as an auxiliary material for soldering. Lead-containing solder paste is all composed of a mixture of soldering flux components and alloy components. Among the alloy components, tin and lead are the main ones. But what is the role of lead in it? In which fields is it generally used? All these need to be understood clearly. Now, JJYSolder paste manufacturerLet me tell you all:

There is lead solder paste


The smaller the tin powder is, the larger the area it has in contact with air will be, and thus it is more prone to oxidation. So when choosing solder paste, it is not the case that the smaller the particles of the solder powder, the better. Instead, it should be determined based on the requirements of the product, and the uniformity of the solder paste particles should also be specified.
The smaller the diameter of the tin powder is, the easier it is to roll off the openings of the steel plate. That is to say, it is easier to pass through the steel plate and be printed on the circuit board. Moreover, it is less likely to remain at the edge of the openings on the steel plate, which helps to improve the printing ability of fine pitch and also makes it easier to obtain a consistent amount of solder paste printing. Moreover, smaller tin powder can also better enhance its collapse resistance and has a better wetting effect.
The tin powder particles of the solder paste we generally use are20-45umBetween, it is divided into3#with4#For powder, manufacturers can choose solder paste that suits the size of their tin powder particles according to their product requirements.
The main functional components include: matrix, demolding agent and surfactant.
The matrix is the main component of leaded solder paste, controlling the melting point of the leaded solder paste. After melting, it covers the surface of the solder joint, playing a role in isolating air. At the same time, it is also the solvent for other functional components.
Demolding agents remove, break or loosen the surface oxide film of the base material through physical and chemical processes, allowing the molten filler metal to wet the fresh surface of the base material.

Surfactants can further reduce the interfacial tension between the molten filler metal and the base metal, promoting better spreading of the molten filler metal on the surface of the base metal.

Surfactant(surfactant)It refers to the addition of a small amount of a substance that can cause a significant change in the interface state of its solution system. It has fixed hydrophilic and lipophilic groups and can be directionally arranged on the surface of the solution. The molecular structure of surfactants is amphiphilic: one end is a hydrophilic group and the other end is a hydrophobic group. Hydrophilic groups are often polar groups, such as carboxylic acids, sulfonic acids, sulfuric acids, amino or amine groups and their salts, hydroxyl groups, amide groups, ether bonds, etc. can also serve as polar hydrophilic groups. The hydrophobic groups are often non-polar hydrocarbon chains, such as8Hydrocarbon chains with more than one carbon atom.

Summary: Due to the fact that lead has good miscibility with tin, oxidation resistance, corrosion resistance, and is easy to process and form, adding lead to tin can achieve excellent properties that neither tin nor lead possesses.

And in which fields is it generally used? Generally, it isLEDThe automotive industry supplies, the application of secondary tube luminescence, and many other specific welding conditions related to this tea product have all been clarified first. Lead solder paste printing has good rolling and tin dropping properties, and is relatively low0.4mmThe pitch pads can also achieve exquisite printing. Leaded solder paste can meet the requirements of different grades of soldering equipment. It does not need to complete soldering in a nitrogen-filled environment and still shows good soldering performance within a wide reflow oven temperature range,Use heating up---Insulated type or Stepwise heating type Both types of furnace temperature setting methods can be used. Lead-containing solder paste leaves very little residue after soldering, has a very light color and a relatively large insulation resistance, and will not corrodePCBIt can meet the requirement of being washable ; Leaded solder paste is of better qualityICTTest performance and there will be no misjudgment. There is lead solder pasteIt can be used for coating through hole rollers. If you still have any questions, please feel free to ask=Shenzhen JJY Industrial Technology Co., Ltd. leads everyone to learn and exchange together!



edit: JJY

Suggested Resources