insmtDuring processing and production, the phenomenon of tin beads may occur. This issmtOne of the main drawbacks of surface mount technology often troubles peopleSMTThe staff of the processing plant. inPCBADuring the processing, it is inevitable that some tin beads will remain on the surface of the board. Therefore, it is acceptable for tin beads that meet the standards. Now, let's take a look at JJYSolder paste manufacturerLet me introduce to you the acceptable standards for tin beads:

1The diameter of the tin beads shall not exceed0.13mm

2Diameter0.05mm-0.13mmThe tin beads are here600mm2Not exceeding within the range5a(Single-sided)

3Diameter0.05The following quantities of tin beads are not required

4,PCBAAll the solder beads on the board must be wrapped with flux and cannot be moved (the flux is encapsulated to the height of the solder beads)1/2The above is determined as coercion.

5The tin beads did not reduce the electrical gap between different network conductors to0.13mmThe following

smtThe appearance inspection standard for surface mount technology products is one of the most fundamental criteria for the acceptance of electronic products. Depending on different products and customer requirements, the acceptable requirements for solder beads may vary. Generally, the standard is determined based on the national standard and combined with the customer's requirements.

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