Everyone should be clearSolder pasteIt is divided into leaded and lead-free types. The ratio of leaded solder paste is:SN63 PB37 Lead-free solder paste95.4Sn/3.1Ag/1.5CuSo the gold content of these will also vary. Therefore, when choosing the corresponding products, everyone should pay attention. Now, the solder paste manufacturer will explain some of their functions to you?

inSMTIn the manufacturing process, it is used63tin／37Lead (tin accounts for 63 percent of the weight of the tin-lead alloy, lead accounts for 37 percent, melting point is.183℃It is mainly used and can also be used60tin／40Lead (melting point:183℃-188℃Tin-lead alloy. It is used for contacts containing silver, such as the conductors of thick film mixed circuits62tin／36lead／1Silver (melting point is179℃The silver-containing alloy is used for welding.

5Bismuth: It lowers the melting point, has strong wetting ability, but the solder joint is relatively hard and brittle

The components of solder paste: The main function of flux

1Make the metal particles into a paste to adapt to the printing process;

2Control the fluidity of the solder paste; 

3Remove the oxides on the soldering surface and solder paste to improve the soldering performance; 

4Slow down the chemical reaction of solder paste at room temperature and form a protective layer on the surface of the soldering point; 

5Reduce the surface tension of welding and provide stabilitySMTThe adhesive force required during patching;

The above is some valuable information we have brought to you today. We hope it can be helpful to you. If you have any further questions or need further information, JJY has it12With years of R&D and production experience, we have a strong technical force and stable product quality. We are an electronic solder manufacturer As a provider of customized solder solder solutions integrating the research and development, production customization and solution services of solder paste, solder wire, solder bar, etc., the brand "JJY" it operates has been selected for the Brand Power Demonstration Project [Solder Materials].