Syringe solder pasteIncluding lead-free syringe solder paste, low-temperature syringe solder paste, leaded syringe solder paste and other series. By adopting advanced filling technology and specially deploying flux formulas with the fluidity and extrusion characteristics of the needle tubes, no air bubbles will be left in the needle tube solder paste. This brings good news to customers who are interested in dispensing operation methods and processes, and solves the spot soldering problems in the semiconductor chip and automotive electronics related industries. The solder paste manufacturer will explain it to you below:

Product features of syringe solder paste:

Environmental protection: Meets standardsRoHSDirective2002/95/EC.

Halogen-free: An important basisEN14582No halogen was detected in the test, achieving a complete halogen-free effect.

Excellent spot coating performance: The paste is smooth, the spot coating is more uniform, the tin comes out naturally, the tin is continuously applied, and it is extremely fine0.15mmThe needle can be maintained to reach8Reliable dot coating performance for hours.

Strong reliability: Free of halogensIPCClassificationROL0Only in this way can a good thermal stability be ensured to guarantee the excellent reliability coefficient of the product.

The production process has a wide range of applications: The temperature recovery operation method can be achieved without mixing. The wide production process window ensures the unprecedented production volume required by the welding process, maintaining good performance and very few adverse phenomena.

The advantages of the syringe solder paste itself

UseSOLCHEMThe needle-type solder paste is implemented in accordance with the soldering process requirements and is the most effective, fastest and most stable design scheme among the soldering process requirements. In combination with various manual or automated spot welding auxiliary tools, spot solder paste can complete fine, simple, repetitive and reliable welding work.

SOLCHEMThe needle-type solder paste is developed with cutting-edge technology, which can effectively prevent the separation of alloy particles and flux in the solder paste. Each alloy particle in the solder paste is more evenly wrapped by the flux and stably suspended together with the solder paste. Even when placed vertically, the quality of the solder paste will not be damaged.